Interposer substrates with multisegment interconnect slots, semiconductor die packages including same, semiconductor dice for use therewith and methods of fabrication

A semiconductor package, comprising:

• a substantially planar interposer substrate, comprising:
• a first surface;
• a second, opposing surface;
• an elongated interconnect slot between the first and second surfaces and extending between longitudinally opposing slot ends about a centerline of the interposer substrate;
• and
• at least one crosspiece extending transversely across the interconnect slot intermediate the opposing slot ends;
• and
• a semiconductor die having an active surface, an opposing back surface, sides extending therebetween and a plurality of bond pads generally linearly disposed on the active surface adjacent a centerline of the semiconductor die;
• wherein the active surface of the semiconductor die is secured to the first surface of the interposer substrate with the plurality of bond pads exposed through the interconnect slot.