Semiconductor devices, manufacturing methods therefore, circuit substrates and electronic devices
AssigneeSeiko Epson Corporation
InventorKoji Yamaguchi
Life of this patent
Estimating the term…
Abstract
To provide semiconductor devices that are electrically highly reliable, and excellent in mountability, manufacturing methods therefore, circuit substrates and electronic devices, a semiconductor device includes a first semiconductor chip, a second semiconductor chip mounted on the first semiconductor chip, and an electrical connection section that is formed between the first semiconductor chip and the second semiconductor chip and electrically connects the first semiconductor chip and the second semiconductor chip. A plurality of protruded electrodes are formed in an exposed portion on a surface of the first semiconductor chip on which the second semiconductor chip is mounted, which is exposed outside the second semiconductor chip.
Claims26
A semiconductor device, comprising:
- a first semiconductor chip;
- a second semiconductor chip mounted on the first semiconductor chip;
- and
- an electrical connection section that is formed between the first semiconductor chip and the second semiconductor chip and electrically connects the first semiconductor chip and the second semiconductor chip,
- a plurality of protruded electrodes formed in an exposed portion on a surface of the first semiconductor chip on which the second semiconductor chip is mounted, which is exposed outside the second semiconductor chip.
A semiconductor device, comprising:
- a first semiconductor chip;
- a second semiconductor chip mounted on the first semiconductor chip;
- an electrical connection section that is formed between the first semiconductor chip and the second semiconductor chip and electrically connects the first semiconductor chip and the second semiconductor chip;
- a substrate having a wiring pattern;
- and
- wires,
- a plurality of protruded electrodes formed in an exposed portion on a surface of the first semiconductor chip on which the second semiconductor chip is mounted, which is exposed outside the second semiconductor chip,
- the first and second semiconductor chips mounted on the substrate, and
- the wiring pattern and the protruded electrodes electrically connected to the wires.
A semiconductor device, comprising:
- a first semiconductor chip;
- a second semiconductor chip mounted on the first semiconductor chip;
- an electrical connection section that is formed between the first semiconductor chip and the second semiconductor chip and electrically connects the first semiconductor chip and the second semiconductor chip;
- and
- a substrate having a wiring pattern;
- a plurality of protruded electrodes formed in an exposed portion on a surface of the first semiconductor chip on which the second semiconductor chip is mounted, which is exposed outside the second semiconductor chip, and
- the protruded electrodes opposed and electrically connected to the wiring pattern.
A method to manufacture a semiconductor device, comprising:
- (a) forming first protruded electrodes and second protruded electrodes on a first semiconductor chip;
- (b) forming third protruded electrodes on a second semiconductor chip;
- and
- (c) mounting the second semiconductor chip in a region of the first semiconductor chip where the first protruded electrodes are formed, and electrically connecting the first protruded electrodes and the third protruded electrodes which are opposed to one another.
A method to manufacture a semiconductor device, comprising:
- (a) forming first protruded electrodes and second protruded electrodes on a first semiconductor chip;
- (b) forming third protruded electrodes on a second semiconductor chip;
- (c) mounting the second semiconductor chip in a region of the first semiconductor chip where the first protruded electrodes are formed, and electrically connecting the first protruded electrodes and the third protruded electrodes which are opposed to one another;
- (d) mounting the first semiconductor chip and the second semiconductor chip on a substrate having a wiring pattern;
- and
- (e) electrically connecting the second protruded electrodes and the wiring pattern with wires.
A method to manufacture a semiconductor device, comprising:
- (a) forming first protruded electrodes and second protruded electrodes on a first semiconductor chip;
- (b) forming third protruded electrodes on a second semiconductor chip;
- (c) mounting the second semiconductor chip in a region of the first semiconductor chip where the first protruded electrodes are formed, and electrically connecting the first protruded electrodes and the third protruded electrodes which are opposed to one another;
- and
- (d) electrically connecting the second protruded electrodes and a wiring pattern formed on a substrate which are opposed to one another.
Dependencies are inferred from the claim text.