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US 2004/0201097 A1Published application
Semiconductor device and method for manufacturing the same
AssigneeOki Electric Industry Co., Ltd.
InventorTakashi Ohsumi
Life of this patent
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Abstract
A semiconductor device which is manufactured through a process of forming a second structure on a first structure, by using a photolithography technique, the semiconductor device includes a mark which is provided at a part of the first structure to be covered by the second structure and which is necessary for forming the second structure.
Claims12
A semiconductor device which is manufactured through a process of forming a second structure on a first structure, by using a photolithography technique, the semiconductor device comprising:
- a mark which is provided at a part of the first structure to be covered by the second structure and which is necessary for forming the second structure.
A semiconductor device comprising:
- a semiconductor substrate having a major surface on which a circuit element is formed;
- an electrode pad formed on the major surface and electrically connected with the circuit element;
- an insulting film formed over the major surface so as to expose a part of the electrode pad;
- a wiring extending from the electrode pad to a surface of the insulating film and having a recess part formed on a surface of the wiring, the recess part being positioned over a predetermined area of the insulating film;
- a conductive member formed on the wiring including the recess part;
- a sealing resin formed on the insulating film so as to cover the wiring and a side of the conductive member;
- and
- an external terminal formed on the conductive member.
5 more elements
A semiconductor device comprising:
- a semiconductor substrate having a major surface on which a circuit element is formed;
- an electrode pad formed on the major surface and electrically connected with the circuit element;
- a first insulating film formed over the major surface so as to expose a part of the electrode pad;
- a first wiring layer extending from the electrode pad to a surface of the first insulating film;
- a second insulating film having a first recess part exposing a part of the first wiring layer and a second recess part, the second insulating film being formed on the first insulating film;
- a second wiring layer formed on the second insulating layer including the first recess part and the second recess part;
- a conductive member formed on the second wiring layer;
- a sealing resin formed on the second insulating film so as to cover the second wiring layer and a side of the conductive member;
- and
- an external terminal formed on the conductive member.
7 more elements
Dependencies are inferred from the claim text.