Semiconductor device
AssigneeNEC Electronics Corporation
InventorFutoshi Hosoya
Life of this patent
Estimating the term…
Abstract
A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device (10) of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10). A metal base (10) can have side portions (12) with connection electrodes (15) having a surface level higher than that of electrodes (7 and 8) on a surface of the semiconductor chip (1) by a difference (d). The semiconductor device (10) can be mounted face down without abutting the semiconductor chip (1) against a mounting substrate, thereby preventing mechanical damage to a semiconductor chip (1). At the same time, a solder layer can be formed in the gap between electrodes (7 and 8) and the mounting substrate, thereby raising the reliability of the soldering connection.
Claims21
A semiconductor device, comprising:
- a metal base having a bottom portion formed from a metal plate and at least one connection electrode that extends upward from at least a part of the bottom portion to a first surface level, the at least one connection electrode for mounting the semiconductor device to a mounting surface;
- and
- a semiconductor chip mounted to the bottom portion of the metal base having surface electrodes at a second surface level, the first surface level being higher than the second surface level by a predetermined amount, and the surface electrodes for mounting the semiconductor device to the mounting surface.
5-22. (Cancelled)
Dependencies are inferred from the claim text.