Stacked module systems and methods
AssigneeStaktek Group L.P.
InventorsJulian Partridge, James Douglas Wehrly JR.
Life of this patent
Estimating the term…
Abstract
The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In a preferred embodiment in accordance with the invention, a form standard associated with one or more CSPs provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the contacts of the lower CSP will be compressed before flex circuitry is attached to a combination of the CSP and a form standard to create lower profile contacts between CSP and the flex circuitry.
Claims31
A method for devising a high-density circuit module, the method comprising the steps of:
- providing a first CSP having a planar surface rising from which are contacts, the contacts each rising above the planar surface by a height H;
- attaching a form standard to the first CSP to form a primary combination;
- and
- reducing the height H for each said contact.
A method for devising a high-density circuit module, the method comprising the steps of:
- providing a first CSP having a planar surface rising above which are contacts, the contacts each rising above the planar surface by a height H;
- attaching a form standard to the first CSP to form a primary combination;
- reducing the height H for each said contact;
- providing a flex circuit upon which are located, solder paste sites;
- disposing the primary combination adjacent to the flex circuit to realize areas of contact between the solder paste sites and the contacts that rise above the planar surface of the first CSP;
- attaching the form standard of the combination to the flex circuit to create a unit;
- and
- selectively heating the areas of contact between the solder paste sites and the contacts to form connections between the first CSP and the flex circuit.
A high-density circuit module comprising:
- a first CSP having a planar surface rising from which are contacts, the contacts rising from the planar surface by a height D1;
- a second CSP disposed above the first CSP in stacked disposition;
- a first form standard disposed, in substantial part, above the first CSP;
- flex circuitry connecting the first and second CSPs;
- at least one metallic bond attaching the flex circuitry and the first form standard;
- and
- module contacts, the module contacts extending from the flex circuit by a height Dm, where Dm is greater than D1.
A high-density circuit module comprising:
- a first CSP;
- a second CSP stacked above the first CSP;
- a first form standard associated with the first CSP;
- a second form standard associated with the second CSP;
- and
- flex circuitry connecting the first and second CSPs, the flex circuitry being attached to the first form standard and comprising at least two conductive layers.
A high-density circuit module devised by a method comprising the steps of:
- providing a form standard
- providing first and second CSPs;
- attaching the form standard to the first CSP;
- applying a first metallic material to at least one part of the first form standard;
- providing flex circuitry with an area where flex metallic material is exposed;
- disposing the flex circuitry adjacent to the first form standard to create an area of contact between the flex metallic material and the first metallic material;
- selectively applying heat to the area of contact.
Dependencies are inferred from the claim text.