Electronic device with cavity and a method for producing the same

A Method for producing electronic devices with a cavity above a surface region of a semiconductor chip comprising:

• providing a semiconductor wafer with semiconductor chip positions which have circuit structures to be provided with cavities in predetermined surface regions;
• applying of a patterned plastic layer to the top side of the semiconductor wafer, with the circuit structures to be provided with cavities being left free and with the formation of cavity frames;,
• applying a first adhesive film to the rear side of the semiconductor wafer, and precrosslinking of the adhesive film;
• separating the semiconductor wafer into first semiconductor chips with adhering adhesive film;
• applying the semiconductor chips to a metal frame for flat-conductor-free housings with adhesive bonding of the semiconductor chip and curing of the adhesive film on the rear side of the semiconductor chips;
• producing bonding connections between contact areas on the top side of the semiconductor chip and inner areas of external contacts of the metal frame;
• covering the cavity frames with semiconductor chips which have an adhesive film on respective rear sides;
• packaging the semiconductor chips in a housing plastics composition;
• and
• separating the metal frame into individual electronic devices.