Semiconductor devices and manufacturing methods therefore

Abstract

To provide methods to manufacture semiconductor devices that are excellent in production efficiency. A method to manufacture a semiconductor device includes mounting a first semiconductor chip having first electrodes and second electrodes on a wiring substrate having a wiring pattern, such that a surface on the opposite side of a surface thereof having the first and second electrodes and faces the wiring substrate, and then, mounting a second semiconductor chip having third electrodes on the first semiconductor chip in a region where the first electrodes are formed, and electrically connecting the first electrodes and the third electrodes that are opposed to one another.

Dependencies are inferred from the claim text.