Back to results
US 2004/0201086 A1Published application
Flip chip in leaded molded package with two dies
AssigneeFairchild Semiconductor Corporation
InventorRajeev Joshi
Life of this patent
Estimating the term…
Abstract
A chip device including two stacked dies. The chip device includes a leadframe that includes a plurality of leads. A first die is coupled to a first side of the leadframe with solder and a second die is coupled to a second side of the leadframe with solder. A molded body surrounds at least a portion of the leadframe and the dies.
Claims8
A chip device comprising:
- a. a leadframe comprising a plurality of leads;
- b. a first die coupled to a first side of the leadframe with solder;
- c. a second die coupled to a second side of the leadframe with solder;
- and
- d. a molded body surrounding at least a portion of the leadframe and the dies.
2 more elements
A method of making a chip device, the method comprising:
- providing a leadframe comprising a plurality of leads;
- placing a first die on a first side of the leadframe with first solder therebetween;
- reflowing the first solder at a first temperature;
- flipping the leadframe;
- placing a second die on a second side of the leadframe with second solder therebetween;
- and
- reflowing the second solder at a second temperature lower than the first temperature.
4 more elements
A method of making a chip device, the method comprising:
- providing a leadframe comprising a plurality of leads;
- flipping a first die on a first side of the leadframe with first solder therebetween;
- reflowing the first solder at a first temperature;
- flipping the leadframe;
- flipping a second die on a second side of the leadframe with second solder therebetween;
- reflowing the second solder at a second temperature lower than the first temperature;
- and
- placing a molded body around at least a portion of the leadframe and the dies.
5 more elements
Dependencies are inferred from the claim text.