Resin sealing-type semiconductor device and method for manufacturing the same

A manufacturing method of a resin sealing-type semiconductor device comprising:

• preparing a lead frame including a first die pad portion, a second die pad portion, and outer leads provided in a manner corresponding to the respective die pad portions;
• die-bonding a first semiconductor chip with a large amount of heat generation to the first die pad portion, wire-bonding external electrode leading-out bonding pads of the first semiconductor chip and the outer leads corresponding thereto;
• transfer-molding the first semiconductor chip by a high thermal conductive resin;
• die-bonding a second semiconductor chip smaller in the amount of heat generation than the first semiconductor chip to the second die pad portion, wire-bonding external electrode leading-out bonding pads of the second semiconductor chip and the outer leads corresponding thereto;
• and
• integrally molding, by a non-high thermal conductive resin, the second semiconductor chip including the first semiconductor chip molded by the high thermal conductive resin.

A manufacturing method of a resin sealing-type semiconductor device comprising:

• preparing a lead frame including a first die pad portion, a second die pad portion, and outer leads provided in a manner corresponding to the respective die pad portions;
• die-bonding a first semiconductor chip with a large amount of heat generation to the first die pad portion, wire-bonding external electrode leading-out bonding pads of the first semiconductor chip and the outer leads corresponding thereto;
• molding the first semiconductor chip by potting with a high thermal conductive resin;
• die-bonding a second semiconductor chip smaller in the amount of heat generation than the first semiconductor chip to the second die pad portion, wire-bonding external electrode leading-out bonding pads of the second semiconductor chip and the outer leads corresponding thereto;
• and
• integrally molding, by a non-high thermal conductive resin, the second semiconductor chip including the first semiconductor chip molded by the high thermal conductive resin.