Leadless leadframe electronic package and IR transceiver incorporating same

A method for attaching a leadless lead frame electronic package (LLP) to a circuit board, the method comprising:

• providing an LLP having a lead frame of thermally-and-electrically conductive material encapsulated in an encapsulation of electrically-insulating material to define a planar mounting surface including an exposed web of encapsulation forming a portion of the planar mounting surface, the lead frame including parallel internal and external planar surfaces having at least one cut-out extending from the internal to the external surfaces to define a die-attach pad and at least one connection pad electrically isolated from the die-attach pad, with the external surface of the die-attach pad defining a recessed C-shaped channel therin for receiving the web of encapsulation, the external planar surface of the die-attach pad remaining exposed through the encapsulation adjacent the web, the web and the external planar surface of the die-attach pad adjacent the web extending generally co-planar with the mounting surface;
• and
• thermally connecting at least part of the exposed external surface of the die-attach pad adjacent the web to the circuit board.