Layered microelectronic contact and method for fabricating same

A method for making a microelectronic contact, comprising:

• providing a compliant pad comprising a base adhered to a device substrate, at least one side surface extending away from the device substrate at an angel to a end area distal from the device substrate;
• and
• patterning a trace from a terminal of said substrate to the end area.

A resilient microelectronic contact, comprising an at least partially self-supporting trace attached at a first end to a terminal of a substrate and free from attachment at a second end thereof, extending from the terminal to the second end, having at least a distal portion extending to the second end spaced apart from the surface of the substrate and free to flex in a plane parallel to the surface of the substrate.

A semiconductor device configured for flip-chip mounting to a substrate, comprising:

• a semiconductor device having a plurality of terminals on a surface thereof;
• a plurality of resilient microelectronic contacts, each comprising a rigid trace attached at a first end to each terminal of the device and free from attachment at a second end thereof, extending from each terminal in a direction substantially parallel to the surface of the device to the second end, and having at least a distal portion extending to the second end spaced apart from the surface and compliant in a plane parallel to the surface of the semiconductor device.