Method of forming thin film patterning substrate including formation of banks
AssigneeSeiko Epson Corporation
InventorsShunichi Seki, Hiroshi Kiguchi, Ichio Yudasaka, Hiroo Miyajima
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AssigneeSeiko Epson Corporation
InventorsShunichi Seki, Hiroshi Kiguchi, Ichio Yudasaka, Hiroo Miyajima
Estimating the term…
Display devices such as EL elements or LED elements, or color filters, are provided, wherewith, when forming thin films such as organic semiconductor films or colored resins, there is remarkably little variation in film thickness from pixel to pixel. When fabricating thin film elements having banks of a prescribed height and a thin film layer formed by an ink jet method in areas to be coated that are partitioned by those banks, if the width of the banks is made a (μm), the height thereof is made c (μm), the width of the areas to be coated is made b (μm), and the diameter of the liquid droplets of the liquid material forming the thin film layer is made d (μm), the banks are formed on the substrate so as to satisfy the conditions that a>d/4, d/2<b<5d, c>t0 (where t0 (μm) is the film thickness of the thin film layer), and c>½×d/b. Furthermore, banks are formed of an organic material on a bank formation surface configured of an inorganic material, plasma treatment is performed under conditions that the induction gas is fluorine-based and that fluorine is present excessively, and the areas enclosed by the banks subjected to surface treatment are filled with the liquid thin film material to form the thin film layer or layers. Also, immediately after performing an oxygen gas plasma treatment on the substrate having the banks formed of
A thin film patterning substrate, comprising:
A thin film patterning substrate, comprising:
A thin film patterning substrate, comprising:
An EL device comprising:
An EL device comprising:
A thin film patterning substrate, comprising:
Dependencies are inferred from the claim text.