Method and apparatus for capturing and using design intent in an integrated circuit fabrication process
AssigneeApplied Materials, Inc.
InventorsJohn H. Madok, Dennis J. Yost, Robin W. Cheung
Life of this patent
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AssigneeApplied Materials, Inc.
InventorsJohn H. Madok, Dennis J. Yost, Robin W. Cheung
Estimating the term…
A method and apparatus for capturing and using design intent within an IC fabrication process. The design intent information is produced along with the design release by a design company. The design release and design intent information are coupled to an IC manufacturing facility where the design release is used for producing the layout of the integrated circuit and the design intent information is coupled to the equipment, especially the metrology equipment, within the IC manufacturing facility. As such, the design intent information can be used to optimize processing during IC fabrication to achieve optimization of the critical characteristics intended by the designer.
A method of fabricating integrated circuits comprising:
Apparatus for fabricating an integrated circuit comprising:
A business method for fabricating an integrated circuit comprising:
A method for improving integrated circuit (IC) manufacturing comprising:
An integrated circuit manufacturing facility comprising integrated circuit manufacturing equipment adapted to operate in accordance with an integrated circuit design release and design intent information.
Dependencies are inferred from the claim text.