Semiconductor device
AssigneeNEC Electronics Corporation
InventorFutoshi Hosoya
Life of this patent
Estimating the term…
Abstract
A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device (10) of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10). A metal base (10) can have side portions (12) with connection electrodes (15) having a surface level higher than that of electrodes (7 and 8) on a surface of the semiconductor chip (1) by a difference (d). The semiconductor device (10) can be mounted face down without abutting the semiconductor chip (1) against a mounting substrate, thereby preventing mechanical damage to a semiconductor chip (1). At the same time, a solder layer can be formed in the gap between electrodes (7 and 8) and the mounting substrate, thereby raising the reliability of the soldering connection.
Claims21
1-12. (cancelled)
A semiconductor device, comprising:
- a metal base having a bottom portion formed from a metal plate and at least one connection electrode for mounting the semiconductor device to a mounting surface, the at least one connection electrode extending upward from the bottom portion and being formed from portions of the metal plate that are thicker than remaining portions;
- and
- a semiconductor chip mounted to the bottom portion of the metal base having a surface with surface electrodes for mounting the semiconductor device to the mounting surface;
- wherein
- the area of each of the at least one connection electrodes is less than the area of any of the surface electrodes.
Dependencies are inferred from the claim text.