Method of fabricating multi layer mems and microfluidic devices
AssigneeReveo, Inc.
InventorSadeg M. Faris
Life of this patent
Estimating the term…
Abstract
A method for fabricating multi layer microelectromechanical and microfluidic devices is disclosed. Multi layer microelectromechanical and microfluidic devices are fabricated on a substrate with layers of predetermined weak and strong bond regions where deconstructed layers of devices at or on the weak bond regions. The layers are then peeled and subsequently bonded to produce a multi layer microelectromechanical and microfluidic devices. An arbitrary number of layers can be bonded and stacked to create either microelectromechanical or microfluidic device or a hyrbid type of device. Also disclosed are methods of creating edge interconnects and vias through the substrate to form interconnections between layers and devices thereon.
Claims48
A method of fabricating a vertical microelectromechanical device, the method comprising the steps of:
- providing a bulk substrate;
- selectively creating strong bond regions and weak bond regions on said substrate;
- providing a first bonded semiconductor layer vertically supported on said substrate;
- creating an electrode on said first bonded semiconductor layer, said electrodes corresponding to said weak bond regions;
- creating an actuatable element disposed opposite said electrode;
- removing said first semiconductor layer from said bulk substrate;
- and
- bonding said first semiconductor layer to a second semiconductor layer.
The method of clam 1 further comprising the step of interconnecting said first semiconductor layer with said second semiconductor layer.
A vertical MEMs device comprising:
- a bulk substrate on a wafer;
- a first selectively bonded semiconductor layer vertically supported on said substrate, said bonded semiconductor layer containing weak bond regions and strong bond regions;
- a second selectively bonded semiconductor layer vertically supported on said first selectively bonded semiconductor layer;
- wherein an electrode and an actuatable element are created at or on said weak bond regions;
- wherein said electrode and said actuatable element are disposed opposite each other, and
- wherein said electrode and said actuatable element vertically spans said first selectively bonded semiconductor layer and said second selectively bonded semiconductor layer.
A vertical MEMs device formed on a die comprising:
- a bulk substrate on a wafer;
- a first selectively bonded semiconductor layer vertically supported on said substrate, said bonded semiconductor layer containing weak bond regions and strong bond regions;
- a second selectively bonded semiconductor layer vertically supported on said first selectively bonded semiconductor layer;
- wherein an element and an actuatable element are created at or on said weak bond regions;
- wherein said element and said actuatable element vertically spans said first selectively bonded semiconductor layer and said second selectively bonded semiconductor layer, and
- wherein said die is formed by dicing said bonded semiconductor layers.
A method of fabricating a multi layer microfluidic device, the method comprising the steps of:
- providing a bulk substrate;
- selectively creating strong bond regions and weak bond regions on said substrate;
- providing a first bonded layer vertically supported on said substrate;
- creating a port on said first bonded layer, said port corresponding to said weak bond regions;
- creating a channel mechanically coupled to said port;
- removing said first layer from said bulk substrate;
- and
- bonding said first layer to a second layer.
The method of clam 26 further comprising the step of interconnecting said first layer with said second layer.
A multilayer microfluidic device comprising:
- a bulk substrate on a wafer;
- a first selectively bonded layer vertically supported on said substrate, said bonded layer containing weak bond regions and strong bond regions;
- a second selectively bonded layer vertically supported on said first selectively bonded layer;
- wherein deconstructed ports and deconstructed channels are created at or on said weak bond regions, and
- wherein said ports and channels vertically span said first selectively bonded layer and said second selectively bonded layer.
A multilayer microfluidic device formed on a die comprising:
- a bulk substrate on a wafer;
- a first selectively bonded layer vertically supported on said substrate, said bonded layer containing weak bond regions and strong bond regions;
- a second selectively bonded layer vertically supported on said first selectively bonded layer;
- wherein deconstructed ports and deconstructed channels are created at or on said weak bond regions;
- wherein said ports and channels vertically span said first selectively bonded layer and said second selectively bonded layer, and
- wherein said die is formed by dicing said bonded semiconductor layers.
Dependencies are inferred from the claim text.