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AssigneeFry's Metals, Inc.
InventorsBrian G. Lewis, Bawa Singh, John P. Laughlin, David V. Kyaw, Anthony E. Ingham, Attiganal N. Sreeram, Leszek Hozer, Michael J. Liberatore, Gerard R. Minogue
Estimating the term…
A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
A thermal interface material for bonding components of electronic devices, the thermal interface material comprising:
A thermal interface material for bonding components of electronic devices, the thermal interface material comprising:
An active solder that wets metallic and non-metallic surfaces without extrinsic fluxing, the active solder comprising a bonding component selected from the group consisting of In, Cu, Au, Sn, Pb, Sb, Ag, alloys thereof, Bi alloys, and mixtures thereof, and an intrinsic oxygen getter selected from the group consisting of rare earth metals, alkali metals, alkaline-earth metals, refractory metals, Zn, alloys thereof, and mixtures thereof.
An active solder that wets metallic and non-metallic surfaces without extrinsic fluxing, the active solder comprising a bismuth alloy bonding component, and an intrinsic oxygen getter selected from the group consisting of rare earth metals, alkali metals, alkaline-earth metals, refractory metals, Zn, alloys thereof, and mixtures thereof.
A multilayer solder preform for bonding components of electronic devices comprising:
A solder preform for bonding components of electronic devices comprising:
Dependencies are inferred from the claim text.