Solder reflow oven
AssigneeVisteon Global Technologies, Inc.
InventorLakhi Nandlal Goenka
Life of this patent
Estimating the term…
Abstract
A solder reflow oven comprises a reflow zone for heating a workpiece using heated air to a temperature effective to reflow solder. The reflow zone comprises a nozzle having divergent vanes that direct shear layers into neighboring zones to extend the distance over which the workpiece is heated to effective solder reflow temperatures.
Claims14
A solder reflow oven comprising a reflow zone for heating a workpiece that includes a solder to a temperature effective to reflow said solder, and a pre-reflow zone and a post-reflow zone about said reflow zone, said solder reflow oven further comprising:
- a conveyor for transporting the workpiece in a travel direction sequentially through the pre-reflow zone, the reflow zone and the post-reflow zone;
- a plenum for supplying heated air to the reflow zone, said plenum comprising a front side and a rear side in spaced relationship transverse to the travel direction and defining a plenum opening therebetween, said plenum opening having a first dimension in said travel direction;
- and
- a nozzle for receiving heated air from said plenum and directing said heated air toward said conveyor, said nozzle comprising front and rear vanes in divergent relationship and defining a nozzle opening adjacent the conveyor having a second dimension in said travel direction less than or equal to the first dimension.
A solder reflow oven comprising a reflow zone for heating a workpiece that includes a solder to a temperature effective to reflow said solder, and an a pre-reflow zone and a post-reflow zone about said reflow zone, said solder reflow oven further comprising:
- a conveyor for transporting the workpiece in a travel direction sequentially through the pre-reflow zone, the reflow zone and the post-reflow zone;
- a plenum for supplying heated air to the reflow zone, said plenum comprising a front side and a rear side in spaced relationship transverse to the travel direction and defining a plenum opening therebetween, said plenum opening having a first dimension in said travel direction;
- a nozzle for receiving heated air from said plenum and directing said heated air toward said conveyor, said nozzle comprising front and rear vanes in divergent relationship and defining a nozzle opening adjacent the conveyor having a second dimension in said travel direction less than or equal to the first dimension;
- and
- at least one heater configured to supply heated air to the pre-reflow zone, said heater not connected to the plenum for supplying heated air to the reflow zone.
A solder reflow oven comprising a reflow zone for heating a workpiece that includes a solder to a temperature effective to reflow said solder, and an a pre-reflow zone and a post-reflow zone about said reflow zone, said solder reflow oven further comprising:
- a conveyor for transporting the workpiece in a travel direction sequentially through the pre-reflow zone, the reflow zone and the post-reflow zone;
- a plenum for supplying heated air to the reflow zone, said plenum comprising a front side and a rear side in spaced relationship transverse to the travel direction and defining a plenum opening therebetween, said plenum opening having a first dimension in said travel direction;
- and
- a nozzle for receiving heated air from said plenum and directing said heated air toward said conveyor, said nozzle including front and rear vanes in divergent relationship and defining a nozzle opening adjacent the conveyor having a second dimension in said travel direction less than or equal to the first dimension, and said nozzle including at least one vane extending in said travel direction and shaped for directing air flow transverse to said travel direction.
Dependencies are inferred from the claim text.