Method for forming bonding pads
AssigneeLG Electronics Inc.
InventorsSung-Gue Lee, Yong-Il Kim
Life of this patent
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Abstract
A method for forming bonding pads on a printed circuit board (PCB) with circuit patterns is provided. A plurality of copper patterns are formed on the PCB which are electrically connected to the circuit patterns, and a filler is filled between the copper patterns such that an upper surface of the copper pattern is exposed. A plating layer is then applied to the exposed upper surface of the copper patterns. Protrusion of the plating layer at a lower portion of a copper pattern is prevented, thus reducing an interval between the wire bonding pad(s) and potentially increasing the number of bonding pads which may be effectively formed on a given PCB.
Claims27
A method for forming a plurality of bonding pads on a printed circuit board (PCB) having a plurality of circuit patterns, comprising:
- forming a plurality of copper patterns on a substrate, the copper patterns being electrically connected with the circuit patterns on the PCB;
- filling a filler at spaces between the copper patterns;
- flattening an upper surface of the filler such that upper surfaces of the copper patterns are exposed;
- and
- applying a plating layer to only the upper surfaces of the copper patterns.
A method for forming a plurality of bonding pads on a printed circuit board (PCB) having a plurality of circuit patterns, comprising:
- forming a plurality of copper patterns on a substrate;
- thereafter filling a filler at spaces formed between adjacent copper patterns;
- flattening an upper surface of the filler such that upper surfaces of the plurality of copper patterns are exposed and the filler remains in the spaces formed between adjacent copper patterns;
- and
- applying a plating layer to only the upper surfaces of the plurality of copper patterns.
15 The method of claim 14, wherein the gold plating layer is formed on both side surfaces and an upper surface of the nickel plating layer.
The method of claim 15, wherein the gold plating layer is formed thinner than the nickel plating layer.
A method for forming a bonding pad on a printed circuit board (PCB) having a plurality of circuit patterns, comprising:
- forming a copper pattern on a substrate;
- filling a filler at a space formed adjacent the copper pattern;
- flattening an upper surface of the filler such that an upper surface of the copper pattern is exposed;
- and
- applying a plating layer to only the upper surface of the copper pattern.
A method for forming a plurality of pads on a printed circuit board (PCB) having a plurality of circuit patterns, the method comprising:
- forming a plurality of copper patterns on a substrate, the copper patterns being electrically connected with the circuit patterns on the PCB;
- filling a filler at spaces formed between the plurality of copper patterns;
- exposing at least one surface of the plurality of copper patterns;
- flattening an upper surface of the filler;
- and
- applying a gold plating layer to exposed surfaces of the plurality of copper patterns.
Dependencies are inferred from the claim text.