Bonding pads for a printed circuit board
AssigneeLG Electronic Inc.
InventorsSung-Gue Lee, Yong-Il Kim
Life of this patent
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Abstract
Bonding pad(s) for a printed circuit board with circuit patterns are provided. The bonding pad(s) include a plurality of copper patterns formed on the PCB and electrically connected to the circuit patterns, a filler filled between the copper patterns such that an upper surface of the copper pattern is exposed, and a plating layer applied at an upper surface of the copper patterns. An interval between wire bonding pad(s) is reduced by preventing a nickel plating layer and a gold plating layer from protruding at a lower portion of a copper pattern when they are formed on the copper patterns.
Claims9
A plurality of bonding pads formed on a printed circuit board (PCB), including a substrate having circuit patterns formed thereon, comprising:
- a plurality of copper patterns formed on the substrate and electrically connected to the circuit patterns;
- a filler filled in spaces between adjacent copper patterns up to a height substantially level with upper surfaces of the plurality of copper patterns such that upper surfaces of the plurality of copper patterns are exposed;
- and
- a plating layer applied to only upper surfaces of the plurality of copper patterns, wherein the plating layer is not copper.
Dependencies are inferred from the claim text.