Terminal electrode forming method in chip-style electronic component and apparatus therefor

A terminal electrode forming apparatus for chip-style electronic components comprising:

• a first tape running mechanism to run a first adhesive tape coated with an adhesive on a surface thereof;
• a second tape running mechanism to run a second adhesive tape coated with an adhesive on a surface thereof;
• an electronic component supply unit to adhere ends of a group of the chip-style electronic components to the adhesive-coated surface of said first adhesive tape in a manner in which said chip-style electronic components are arrayed;
• a first paste applying unit to press the other ends of the group of the chip-style electronic components conveyed by the running of said first adhesive tape to a coating flat bed thereby applying conductive paste to the other ends of the group of the chip-style electronic components;
• a first drying unit for drying the conductive paste applied on the other ends of the group of the chip-style electronic components;
• a transfer unit for transferring the group of the chip-style electronic components having passed through said drying unit, from said first adhesive tape to a second adhesive tape thereby causing the group of the chip-style electronic components to be held at the ends coated with the conductive paste by the second adhesive tape;
• a second paste applying unit for pressing the ends, not coated with the conductive paste, of the group of the chip-style conductive components conveyed by the running of said second adhesive tape to a coating flat bed thereby applying the conductive paste;
• a second drying unit for drying the conductive paste applied on the ends of the group of the chip-style electronic components;
• and
• a discharge unit for peeling off the group of the chip-style electronic components from said second adhesive tape.