Substrate processing apparatus
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsSeiichiro Okuda, Hiroaki Sugimoto, Takuya Kuroda, Masanobu Sato, Sadao Hirae, Shuichi Yasuda, Kenya Morinishi, Masayoshi Imai
Life of this patent
Estimating the term…
Abstract
The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.
Claims63
An apparatus for removing residuary pollution from a substrate, said apparatus comprising:
- a) a spin mechanism for holding and rotating said substrate;
- and
- b) a liquid supply mechanism for supplying at least one liquid onto said substrate being rotated, comprising
- b-1) a mist supply mechanism for mixing a gas with a processing liquid to generate mist and supplying said mist onto said substrate being rotated in a removing process for removing said residuary pollution from said substrate.
An apparatus for removing residuary pollution from a substrate, comprising:
- a) a spin mechanism for holding and rotating said substrate;
- and
- b) a remover liquid supply unit for supplying remover liquid onto said substrate being rotated to remove said residuary pollution from said substrate,
- c) a deionized water supply unit for supplying a deionized water onto said substrate being rotated, and
- d) at least one ultrasonic oscillator for applying ultrasonic wave to at least one of said remover liquid and said deionized water.
An apparatus for removing residuary pollution from a substrate, comprising:
- a) a spin mechanism for holding and rotating said substrate;
- and
- b) a remover liquid supply unit for supplying remover liquid onto said substrate being rotated to remove said residuary pollution from said substrate,
- c) an intermediate rinse remover liquid supply unit for supplying intermediate rinse onto said substrate being rotated to remove said remover liquid from said substrate,
- d) a deionized water supply unit for supplying a deionized water onto said substrate being rotated, and
- e) at least one ultrasonic oscillator for applying ultrasonic wave to at least one of said remover liquid, said intermediate rinse and said deionized water.
An apparatus for removing residuary pollution caused in an dry-etching process from a substrate, said apparatus comprising:
- a) a spin mechanism for holding and rotating said substrate;
- and
- b) a remover liquid supply unit for supplying remover liquid onto said substrate being rotated to remove said residuary pollution from said substrate while scanning said substrate with said remover liquid.
An apparatus for removing residuary pollution caused in an dry-etching process from a substrate, said apparatus comprising:
- a) a spin mechanism for holding and rotating said substrate;
- and
- b) a remover liquid supply mechanism comprising:
- b-1) a pressure generator for applying pressure to a remover liquid which is effective for removing said chemical residuary pollution to generate a pressured remover liquid, and
- b-2) a nozzle for discharging said pressured remover liquid onto said substrate being rotated, and
- c) a deionized water supply mechanism for supplying deionized water onto said substrate being rotated.
An apparatus for removing chemical residuary pollution caused in an dry-etching process from a substrate, said apparatus comprising:
- a) a spin mechanism for holding and rotating said substrate;
- and
- b) a remover liquid supply unit for supplying remover liquid onto said substrate being rotated to remove said chemical residuary pollution from said substrate being rotated, and
- c) a deionized water supply mechanism comprising:
- c-1) a pressured generator for applying pressure to deionized water to generate a pressured remover liquid, and
- c-2) a nozzle for discharging said pressured deionized water onto said substrate being rotated.
An apparatus for removing chemical residuary pollution caused in an dry-etching process from a substrate, said apparatus comprising:
- a) a spin mechanism for holding and rotating said substrate;
- and
- b) a remover liquid supply unit for supplying remover liquid onto said substrate being rotated to remove said chemical residuary pollution from said substrate being rotated,
- c) an intermediate rinse supply mechanism comprising:
- c-1) a pressured generator for applying pressure to intermediate rinse to generate a pressured intermediate rinse, and
- c-2) a nozzle for discharging said pressured intermediate rinse onto said substrate being rotated, and
- d) a deionized water supply mechanism for supplying said deionized water onto said substrate being rotated.
An apparatus for removing residuary pollution caused in an dry-etching process from a substrate, said apparatus comprising:
- a) a remover liquid supply unit comprising a remover liquid discharging unit for discharging remover liquid onto said substrate being rotated to remove said residuary pollution from said substrate,
- b) a temperature controller for controlling a temperature of said remover liquid,
- c) a driver for moving said remover liquid discharging unit between
- a processing position from which said remover liquid is discharged onto said substrate, and
- a stand-by position from which said remover liquid is discharged to a position defined out of said substrate, and
- d) a controller for controlling said driver and said remover liquid discharging unit such that
- said remover liquid discharging unit is located at said stand-by position and discharges said remover liquid to said position defined out of said substrate, and
- said remover liquid discharging unit is then moved to said processing position and discharges said remover liquid onto said substrate.
An apparatus for removing residuary pollution caused in an dry-etching process from a substrate, said apparatus comprising:
- a) a remover liquid supply unit comprising a remover liquid discharging unit for discharging remover liquid onto said substrate being rotated to remove said residuary pollution from said substrate,
- b) a temperature controller for controlling a temperature of said remover liquid,
- c) a driver for moving said remover liquid emission unit between
- a processing position from which said remover liquid is discharged onto said substrate, and
- a stand-by position from which said remover liquid is discharged to a position defined out of said substrate, and
- d) a controller for controlling said remover liquid discharging unit to discharge said remover liquid to said position defined out of said substrate during said remover liquid discharging unit is located at said stand-by position.
An apparatus for removing residuary pollution from a substrate, comprising:
- a) a spin mechanism for holding and rotating said substrate;
- b) a remover liquid supply unit for supplying remover liquid onto said substrate being rotated to remove said residuary pollution from said substrate;
- c) a brush unit for brushing said substrate;
- d) a deionized water supply unit for supplying a deionized water onto said substrate being rotated;
- and
- d) a controller comprising
- a first control procedure element for controlling said remover liquid supply unit to supply said remover liquid onto said substrate being rotated,
- a second control procedure element for controlling said brush unit to brush said substrate after said remover liquid is supplied onto said substrate being rotated,
- a third control procedure element for controlling said deionized water supply unit to supply said deionized water onto said substrate being rotated after said substrate is brushed, and
- a fourth control procedure element for controlling said spin mechanism to rotate said substrate to disperse said deionized water from said substrate.
An apparatus for removing residuary pollution from a substrate, comprising:
- a) a spin mechanism for holding and rotating said substrate;
- and
- b) a processing liquid supply unit comprising a nozzle for discharging a spreading current of a processing liquid toward said substrate.
An apparatus for removing residuary pollution from a substrate, comprising:
- a) a spin mechanism for holding and rotating said substrate;
- b) a remover liquid supply unit for supplying remover liquid onto said substrate being rotated to remove said residuary pollution from said substrate,
- c) a deionized water supply unit for supplying a deionized water onto said substrate being rotated;
- and
- d) a controller comprising
- a first control procedure element for controlling said remover liquid supply unit to supply said remover liquid onto said substrate being rotated,
- a second control procedure element for controlling said spin mechanism to rotate said substrate to disperse said remover liquid from said substrate, and
- a third control procedure element for controlling said deionized water supply unit to supply said deionized water onto said substrate being rotated after said remover liquid is dispersed.
Dependencies are inferred from the claim text.