Backflush chamber clean

A method of cleaning a substrate processing chamber comprising:

• generating in a remote chamber reactive species suitable for cleaning unwanted material deposits in the processing chamber;
• flowing the reactive species, in order, from the remote plasma chamber through a gas distribution showerhead into the substrate processing chamber and then through an exhaust line during a first time period;
• and
• flowing the reactive species, in order, from the remote plasma chamber into the substrate processing chamber, through the gas distribution showerhead and then through an exhaust line during a second time period.

A substrate processing system comprising:

• a housing defining a process chamber;
• a substrate support for supporting a substrate within the chamber;
• a processing gas source;
• a remote plasma generator;
• a gas distribution showerhead positioned proximate to the substrate support,
• a foreline configured to receive exhaust from the chamber;
• and
• a gas delivery system in selective fluid communication with the processing gas source, the remote plasma source, the gas distribution showerhead, and the foreline, the gas delivery system configurable to flow processing gas from the processing gas source into the chamber through the gas distribution showerhead during processing of a substrate within the chamber, and configurable to flow cleaning plasma from the chamber into the foreline through the gas distribution showerhead during removal of residue from the chamber.