Electronic circuit device and method of manufacturing the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsNorihito Tsukahara, Kazuhiro Nishikawa
Life of this patent
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Abstract
An electronic component having connection terminals on one side thereof is bonded to a circuit board via an adhesive sheet having through-holes. The connection terminals on the electronic component are connected to electrode pads provided on the circuit board via a conductive adhesive in the through-holes. Thus, an electronic circuit device is formed. Using a polymeric resin film sheet for the circuit board and mounting an electronic component, e.g. an LSI, onto the circuit board can provide a small, light, thin, and inexpensive electronic circuit device.
Claims10
An electronic circuit device comprising:
- an electronic component having a connection terminal on one side thereof;
- a circuit board;
- an adhesive sheet having a through-hole;
- and
- a conductive adhesive provided in said through-hole;
- wherein said electronic component and said circuit board are bonded to each other via said adhesive sheet, and said connection terminal on said electronic component and an electrode pad on said circuit board are bonded to each other by said conductive adhesive in said through-hole.
A method of manufacturing an electronic circuit device, comprising:
- bonding an adhesive sheet to a circuit board so that a through-hole, through said adhesive sheet, is aligned with an electrode pad provided on a surface of said circuit board;
- providing a conductive adhesive in said through-hole;
- and
- bonding a connection terminal, provided on one side of an electronic component, to said electrode pad on said circuit board via said conductive adhesive in said through-hole, and bonding said electronic component to said adhesive sheet.
Dependencies are inferred from the claim text.