Leadframeless package structure and method
AssigneeSTMicroelectronics S.r.l.
InventorsHarry M. Siegel, Anthony M. Chiu
Life of this patent
Estimating the term…
Abstract
A method for providing a leadframeless package structure is provided. The method includes providing a temporary carrier. The temporary carrier is coupled to a metal foil layer with a temporary adhesive layer. An integrated circuit chip is coupled to the metal foil layer. The temporary adhesive layer and the temporary carrier are removed to form the leadframeless package structure after molding.
Claims20
A method for providing a leadframeless package structure, comprising:
- providing a temporary carrier;
- coupling the temporary carrier to a metal foil layer with a temporary adhesive layer;
- coupling an integrated circuit chip to the metal foil layer;
- and
- removing the temporary adhesive layer and the temporary carrier to form the leadframeless package structure after molding.
A method for providing a leadframeless package structure, comprising:
- providing a temporary carrier;
- forming a temporary adhesive layer adjacent to the temporary carrier;
- forming a metal foil layer outwardly of the temporary adhesive layer;
- patterning and etching the metal foil layer to form circuit patterns;
- coupling an integrated circuit chip to the metal foil layer;
- coupling each of a plurality of bond pads on the chip to the patterned metal foil layer with one of a plurality of bonding wires;
- forming a molding compound outwardly of the metal foil layer, the bonding wires and the chip;
- and
- removing the temporary adhesive layer and the temporary carrier to form the leadframeless package structure.
A leadframeless package structure, comprising:
- a metal foil layer uncoupled from a temporary carrier;
- an integrated circuit chip coupled to the metal foil layer;
- a plurality of bonding wires, each bonding wire coupling a specified area of the chip to the metal foil layer;
- and
- a molding compound formed outwardly of the metal foil layer, the bonding wires and the chip.
A leadframeless package structure comprising a multi-chip module, the multi-chip module comprising:
- for each of a plurality of integrated circuit chips, a metal foil layer uncoupled from a temporary carrier by removing a temporary adhesive layer coupled between the temporary carrier and the metal foil layer,
- a permanent adhesive coupling the integrated circuit chip to the metal foil layer, and
- a plurality of bonding wires, each bonding wire coupling a specified area of the chip to the metal foil layer;
- and
- a molding compound formed outwardly of the metal foil layers, the bonding wires and the chips.
Dependencies are inferred from the claim text.