Methods of depositing piezoelectric films
AssigneeAviza Technologies, Inc.
InventorsPaul Rich, Mark Ashley Ford
Life of this patent
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Abstract
This invention relates to methods of depositing piezoelectric films such as in part of a stack including depositing a piezoelectric layer, measuring the thickness of the layer and depositing a further film or films such that the combined thickness is substantially equal to the target thickness.
Claims15
A method of depositing a stack of layers of a target thickness to provide a predetermined resonant frequency including depositing a piezoelectric layer, measuring the thickness of the layer and depositing a further film or films such that the combined thickness of the stack is substantially equal to the target thickness.
A method of depositing a stack of layers of a target thickness to provide a resonant frequency including depositing an optically transparent piezoelectric layer and optically measuring the thickness of the layer and depositing a further film or films such that the construed thickness of the stack is substantially equal to the target thickness.
A method of forming a resonator having a predetermined resonator frequency including depositing an electrode, depositing a piezoelectric layer using the method as claimed in any one of the preceding claims and depositing a further electrode if one has not been deposited in a preceding step.
A method of depositing a piezoelectric layer as part of a resonant structure of predetermined resonant frequency, including depositing a layer of piezoelectric material having a thickness of less than a target thickness, measuring the thickness of the deposited layer and depositing a film on the layer such that the thickness of the resonant structure including the film and the layer is substantially equal to the target thickness.
Dependencies are inferred from the claim text.