Device and method for testing integrated circuit dice in an integrated circuit module
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, James M. Wark, Eric S. Nelson, Kevin G. Duesman
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AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, James M. Wark, Eric S. Nelson, Kevin G. Duesman
Estimating the term…
An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging
A switching apparatus for switching first and second voltages to a function circuit in at least one integrated circuit die having at least one external communication terminal, the at least one integrated circuit die being provided in a module having a module terminal for receiving the first voltage from circuitry external to the module, the switching apparatus comprising:
An integrated circuit die comprising:
An integrated circuit module comprising:
A method for initiating at least a first mode and at least a second mode in a function circuit in each circuit die of one or more integrated circuit dice in an integrated circuit module having a module terminal, the function circuit being of the type to enter the at least a first mode and the at least a second mode in response to receiving respectively a first mode initiate signal and a second mode initiate signal, each integrated circuit die including one or more bond pads connected to circuits for receiving a test mode initiate signal at the module terminal, the method comprising:
Dependencies are inferred from the claim text.