US 2004/0176938 A1 · Method for optimizing high frequency performance of via structures

Abstract

A method for enhancing the high frequency signal integrity performance of a printed circuit board (PCB) or backplane is provided. The method may involve the use of the S-parameters as the primary cost factors associated with an iterative process to optimize the physical dimensions and shape of a single or a collection of vias within the PCB or backplane. Such process involves the representation of the via components as equivalent lumped series admittances and impedances, as well as, RLGC sub-circuits upon which basic circuit analysis may be performed to optimize secondary characteristics, for example, the maximization of the sub-circuit's resistance and/or the minimization of the subcircuit's capacitance. The iterative process involves the alteration of physical dimensions and the shape of the via components such that the secondary characteristics are optimized.

Claims20

Dependent claims

A method for optimizing the high frequency performance of at least one via structure, comprising the steps of:

a) defining the top level parameters for optimization;
b) deriving the second level parameters for optimization as functions of said top level parameters;
c) defining economic cost constraints for optimization of both of said top level and said second level parameters;
d) subdividing said at least one via structure into one of several types of transmission line segments;
e) minimizing stub section lengths of said at least one via structure;
f) converting said several types of transmission line segments into equivalent series impedances, shunt element admittances, and a series of discretized RLGC sub-circuits comprised of one or more resistors, R, inductors, L, conductors, G, and capacitors, C;
and
g) optimizing said second level parameters.

5 more elements

A method of optimizing the high frequency performance of at least one via structure, comprising the steps of:

a) transforming said at least one via structure into equivalent determinable basic electrical characteristics;
b) manipulating the physical characteristics of said at least one via structure so as to alter the values of said determinable basic electrical characteristics;
and
c) optimizing said determinable basic electrical characteristics values.

1 more element

Dependencies are inferred from the claim text.

Method for optimizing high frequency performance of via structures

Life of this patent

Method for optimizing high frequency performance of via structures

Life of this patent

Abstract

Claims20