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US 2004/0176816 A1Published application
Lead connection module of a modular implantable medical device
OwnerRuchika Singhal, Carl D. Wahlstrand +2inventors
InventorsRuchika Singhal, Carl D. Wahlstrand, Darren A. Janzig, Robert M. Skime
Life of this patent
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Abstract
A modular implantable medical device includes two or more interconnected modules and an overmold that at least partially encapsulates each of the housings of the modules. The overmold also includes a lead connection module for accepting an external lead. The lead connection module electrically and mechanically couples the lead to the components of the implantable medical device.
Claims14
An implantable medical device comprising:
- at least two interconnected modules, each of the modules comprising a housing;
- and
- an overmold that at least partially encapsulates each of the housings, the overmold comprising a lead connection module for accepting an external lead.
An overmold for a modular implantable medical device comprising:
- a first material configured to hold at least part of a module;
- a second material coupled to the first material;
- and
- a lead connection module configured to accept an external lead, the lead connection module being deployed within the overmold.
1 more element
Dependencies are inferred from the claim text.