Resin composition
AssigneeKaneka Corporation
InventorsKanji Shimo-Ohsako, Takashi Itoh, Masaru Nishinaka, Shigeru Tanaka, Mutsuaki Murakami
Life of this patent
Estimating the term…
Loading patent…
AssigneeKaneka Corporation
InventorsKanji Shimo-Ohsako, Takashi Itoh, Masaru Nishinaka, Shigeru Tanaka, Mutsuaki Murakami
Estimating the term…
The present invention provides a resin composition comprising a polyimide containing particular dianhydride and diamine, and an epoxy resin. The resin composition can be bonded at a relatively low temperature, has excellent heat resistance, adhesion property, soldering heat resistance and retaining ratio of peeling strength after PCT. By forming a circuit using the polyimide resin sheet or the polyimide resin sheet with metal foil, which comprises the resin composition, according to the semi-additive method, a printed wiring board having a good wiring shape, firm adhesion of circuit and high insulating resistance in the microcircuit space can be obtained.
A resin composition comprising a polyimide resin and a thermosetting resin, said polyimide resin being represented by the following formula (1):
A resin composition for adhesive which comprises,
A resin composition for adhesive, comprising,
Dependencies are inferred from the claim text.