Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces

A method for monitoring a characteristic of a polishing pad used for polishing a micro-device workpiece, comprising:

• applying ultrasonic energy to a first region of the polishing pad;
• determining a first status of the characteristic based on a measurement of the ultrasonic energy applied to the first region of the polishing pad;
• applying ultrasonic energy to a second region spaced apart from the first region of the polishing pad;
• and
• determining a second status of the characteristic based on a measurement of the ultrasonic energy applied to the second region of the polishing pad.

A method for conditioning a polishing pad used for polishing a micro-device workpiece, comprising:

• applying ultrasonic energy to the polishing pad;
• determining a status of a characteristic of the polishing pad based on a measurement of the ultrasonic energy applied to the polishing pad;
• and
• adjusting at least one conditioning parameter in response to the determined status of the characteristic of the polishing pad.

A method for conditioning a polishing pad used for polishing a micro-device workpiece, comprising:

• engaging an end effector with the polishing pad and moving at least one of the end effector and the polishing pad relative to each other;
• applying ultrasonic energy to a first region of the polishing pad;
• determining an existing status of a characteristic of the first region of the polishing pad based on a measurement of the ultrasonic energy applied to the first region;
• and
• providing a desired status of the characteristic in the first region of the polishing pad by adjusting at least one conditioning parameter in response to the determined existing status of the characteristic.

A method for polishing a micro-device workpiece, comprising:

• pressing the micro-device workpiece against a polishing pad and moving the workpiece relative to the polishing pad;
• applying ultrasonic energy to a first region of the polishing pad at a
• determining a status of a characteristic of the first region of the polishing pad based on a measurement of the ultrasonic energy applied to the first region;
• and
• adjusting at least one polishing parameter in response to the determined status of the characteristic of the first region.

A system for monitoring a characteristic of a polishing pad used for polishing a micro-device workpiece, comprising:

• a polishing pad having a characteristic;
• a transducer proximate to the polishing pad for applying ultrasonic energy to the polishing pad;
• and
• a controller operatively coupled to the transducer, the controller having a computer-readable medium containing instructions to perform a method comprising
• applying ultrasonic energy to the polishing pad;
• and
• determining a status of the characteristic of the polishing pad based on a measurement of the ultrasonic energy applied to the polishing pad.

A system for monitoring a characteristic of a polishing pad used for polishing a micro-device workpiece, comprising:

• a polishing pad having a characteristic, a first region, and a second region spaced apart from the first region;
• a transducer proximate to the polishing pad for applying ultrasonic energy to the polishing pad;
• and
• a controller operatively coupled to the transducer, the controller having a computer-readable medium containing instructions to perform a method comprising
• applying ultrasonic energy to the first region of the polishing pad;
• determining a first status of the characteristic based on a measurement of the ultrasonic energy applied to the first region of the polishing pad;
• applying ultrasonic energy to a second region of the polishing pad;
• and
• determining a second status of the characteristic based on a measurement of the ultrasonic energy applied to the second region of the polishing pad.

A system for conditioning a polishing pad used for polishing a micro-device workpiece, comprising:

• a conditioner including an end effector;
• a polishing pad having a characteristic;
• a transducer proximate to the polishing pad for applying ultrasonic energy to the polishing pad;
• and
• a controller operatively coupled to the conditioner and the transducer, the controller having a computer-readable medium containing instructions to perform a method comprising
• engaging the end effector with the polishing pad and moving at least one of the end effector and the polishing pad relative to each other;
• applying ultrasonic energy to the polishing pad;
• determining an existing status of the characteristic of the polishing pad based on a measurement of the ultrasonic energy applied to the polishing pad;
• and
• providing a desired status of the characteristic of the polishing pad by adjusting at least one conditioning parameter in response to the determined existing status of the characteristic.

A system for polishing a micro-device workpiece, comprising:

• a polishing pad having a characteristic;
• a micro-device workpiece carrier over the polishing pad, the micro-device workpiece carrier being configured to carry the micro-device workpiece;
• a transducer proximate to the polishing pad for applying ultrasonic energy to the polishing pad;
• and
• a controller operatively coupled to the micro-device workpiece carrier and the transducer, the controller having a computer-readable medium containing instructions to perform a method comprising
• pressing the micro-device workpiece against the polishing pad and moving the micro-device workpiece relative to the polishing pad;
• applying ultrasonic energy to the polishing pad;
• determining a status of the characteristic of the polishing pad based on a measurement of the ultrasonic energy applied to the polishing pad;
• and
• adjusting at least one polishing parameter in response to the determined status of the characteristic of the polishing pad.

A system for monitoring a characteristic of a polishing pad used for polishing a micro-device workpiece, comprising:

• an arm movable over the polishing pad;
• an end effector coupled to the arm, the end effector having a first surface and a plurality of contact elements projecting from the first surface;
• and
• a transducer coupled to the arm, the transducer being configured to apply ultrasonic energy to the polishing pad at a frequency of at least approximately 10 MHz to determine a status of the characteristic of the polishing pad.

A system for monitoring a characteristic of a polishing pad used for polishing a micro-device workpiece, comprising:

• a table;
• a polishing pad carried by the table, the polishing pad having a characteristic;
• and
• a transducer carried by the table, the transducer being configured to apply ultrasonic energy to the polishing pad at a frequency of at least approximately 10 MHz to determine a status of the characteristic of the polishing pad.

A system for monitoring a characteristic of a polishing pad used for polishing a micro-device workpiece, comprising:

• a polishing pad for polishing the micro-device workpiece, the polishing pad having a characteristic;
• a workpiece carrier for carrying the micro-device workpiece, the workpiece carrier being positionable over the polishing pad;
• and
• a transducer carried by the workpiece carrier, the transducer being configured to apply ultrasonic energy to the polishing pad at a frequency of at least approximately 10 MHz to determine a status of the characteristic of the pad.

A system for monitoring a characteristic of a polishing pad used for polishing a micro-device workpiece, comprising:

• a polishing pad for polishing micro-device workpieces, the polishing pad having a characteristic;
• a fluid arm over the polishing pad for providing solution to the polishing pad;
• and
• a transducer carried by the fluid arm, the transducer configured to apply ultrasonic energy to the polishing pad at a frequency of at least approximately 10 MHz to determine a status of the characteristic of the polishing pad.