Back to results
US 2004/0175966 A1Published application
Array socket with a dedicated power/ground conductor bus
AssigneeIntel Corporation
InventorsWilliam O. Alger, Gary B. Long, Gary A. Brist, Carlos Mejia
Life of this patent
Estimating the term…
Abstract
An apparatus for receiving a microchip and having a conductor buses therein. A top surface of the apparatus receives the microchip while the bottom surface is to mount to a circuit board. A plurality of pin receptacles pass through the top surface to receive a corresponding plurality of microchip pins of the microchip. The conductor bus resides at least in part between the top surface and the bottom surface and is electrically coupled to a first plurality of the plurality of the pin receptacles.
Claims28
A method, comprising:
- placing a first conductor bus within an array socket for receiving a microchip;
- inserting a plurality of pin receptacles in a top surface of the array socket to receive a corresponding plurality of microchip pins of the microchip;
- and
- electrically coupling the first conductor bus to a first plurality of the plurality of pin receptacles
1 more element
An apparatus, comprising:
- a top surface to receive a microchip;
- a bottom surface to mount to a circuit board;
- a plurality of pin receptacles passing through the top surface to receive a corresponding plurality of microchip pins of the microchip;
- and
- a first conductor bus residing at least in part between the top surface and the bottom surface and electrically coupled to a first plurality of the plurality of pin receptacles.
2 more elements
A system, comprising:
- a motherboard having one of a pin field and a ball field thereon;
- an array socket to receive a microchip, the array socket mounted to the motherboard and having a plurality of pin receptacles to receive a corresponding plurality of microchip pins of the microchip, a first plurality of the plurality of pin receptacles electrically coupled to the one of the pin field and the ball field;
- and
- a first power/ground bus at least in part within the array socket and electrically coupled to a second plurality of the plurality of pin receptacles.
1 more element
Dependencies are inferred from the claim text.