Substrate carrier with a textured membrane
AssigneeApplied Materials, Inc.
InventorHung Chih Chen
Life of this patent
Estimating the term…
Abstract
A carrier head for a chemical mechanical polishing apparatus includes a membrane with an exterior grooved surface for improved chemical mechanical polishing. The exterior grooved surface provides a path for the flow of air from the portion between the membrane and a substrate.
Claims25
A carrier head for chemical mechanical polishing of a substrate, comprising:
- a base;
- and
- a flexible membrane extending beneath the base to define a pressurizable chamber, an outer surface of the flexible membrane providing a mounting surface for a substrate, the outer surface including a textured portion and a smooth portion surrounding the textured portion.
A chemical mechanical polishing apparatus, comprising:
- a rotatable polishing pad;
- and
- a carrier head including a base and a flexible membrane extending beneath the base to define a pressurizable chamber, a lower surface of the flexible membrane providing a mounting surface for a substrate, the mounting surface including a textured portion and a smooth outer portion surrounding the textured inner portion.
A membrane for a carrier head, comprising:
- an impermeable flexible and elastic membrane having an outer surface, the outer surface including a textured inner portion and a smooth outer portion surrounding the textured inner portion.
A method of chemical mechanical polishing, comprising:
- positioning a substrate against a mounting surface of a flexible membrane of a carrier head, the flexible membrane defining a chamber within the carrier head, the mounting surface including a textured inner portion and a smooth peripheral portion surrounding the textured inner portion;
- and
- evacuating the chamber to form a seal between the smooth peripheral portion and the substrate.
A method of chemical mechanical polishing, comprising:
- positioning a substrate against a mounting surface of a flexible membrane of a carrier head, the flexible membrane defining a pressurizable chamber within the carrier head, the mounting surface including a grooved inner portion and a smooth outer portion surrounding the textured inner portion;
- placing the substrate against a polishing surface;
- and
- pressurizing the chamber to inflate the membrane with a first pressure.
A method of chemical mechanical polishing, comprising:
- positioning a substrate against a mounting surface of a flexible membrane of a carrier head, the flexible membrane defining a chamber within the carrier head, the mounting surface including a grooved inward portion and a smooth peripheral portion;
- polishing the substrate;
- evacuating the chamber to form a seal between the smooth peripheral portion and a substrate after polishing of the substrate;
- transferring the substrate from a polishing pad to an unloading station;
- and
- pressurizing the chamber to inflate the membrane to break the seal between the substrate and the smooth peripheral portion to position the substrate onto the unloading station.
A method of releasing air from a region formed by contact between a substrate and a flexible membrane defining a chamber, comprising:
- evacuating the chamber to form a seal between the substrate and the flexible membrane;
- and
- pressurizing the chamber to break the seal between the substrate and the flexible membrane so that a lip of the flexible membrane separates from the substrate and exposes one or more channels formed on the outer surface of the membrane.
Dependencies are inferred from the claim text.