Novel formation of an aluminum contact pad free of plasma induced damage by applying CMP
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPao-Kang Niu, Shui-Hung Chen, Mu-Chi Chiang, Jou-Yin Liu, Harry Chuang
Life of this patent
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Abstract
A new method is provided for the creation of an aluminum contact pad. A layer of passivation is created over the surface of a substrate, an opening is created through the layer of passivation. A layer of aluminum is deposited over the surface of the deposited layer of passivation, filling the opening that has been created there-through. The deposited layer of aluminum is then polished down to the surface of the layer of passivation, leaving the deposited aluminum in place inside the opening created through the layer of passivation for purposes of serving as a contact pad.
Claims18
A method for the creation of an aluminum contact pad, comprising steps of:
- providing a substrate, at least one point of electrical contact having been provided in or over the surface of said substrate;
- depositing a layer of passivation over the surface of said substrate;
- creating at least one opening through said layer of passivation, said at least one opening being aligned with said at least one point of electrical contact;
- depositing a layer of aluminum over the surface of said substrate, filling said at least one opening with aluminum;
- and
- polishing the surface of said deposited layer of aluminum, removing said layer of aluminum from the surface of said layer of passivation.
A method for the creation of an aluminum contact pad, comprising steps of:
- depositing a layer of aluminum over the surface of a layer of passivation provided over the surface of a substrate, filling at least one opening created through said layer of passivation;
- and
- polishing the surface of said deposited layer of aluminum, removing said layer of aluminum from the surface of said layer of passivation.
A method for the creation of an aluminum contact pad, comprising steps of:
- depositing a layer of aluminum over the surface of a layer of etch stop material deposited over the surface of a layer of passivation provided over the surface of a substrate, filling at least one opening created through said layer of etch stop material and said layer of passivation;
- and
- polishing the surface of said deposited layer of aluminum, removing said layer of aluminum from the surface of said layer of etch stop material.
Dependencies are inferred from the claim text.