Loading patent…
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsAkira Maeda, Takeyuki Maegawa, Shigeru Matsuno, Takuo Ozawa, Takanori Sone, Shoji Miyashita, Yasumichi Hatanaka, Masato Koyama, Takahiro Nagamine, Susumu Arai
Estimating the term…
A metal electrode of the invention is formed on a substrate. The metal electrode includes a first layer, a second layer and a third layer lying from an outermost surface of the metal electrode toward the substrate in this order. The first layer contains tin as a principal constituent and the second layer contains a metallic element which produces an eutectic reaction with tin, wherein the melting point of the first layer is higher than that of the second layer. The third layer is formed as an underlying metallic layer for the first and second layers.
A metal electrode built on a wire which is formed on a substrate, said metal electrode comprising multiple metallic layers including at least a first layer and a second layer lying from an outermost surface of said metal electrode toward the substrate in this order, wherein the first layer contains tin as a principal constituent, the second layer contains a metallic element which produces an eutectic reaction with tin, and the melting point of the first layer is higher than that of the second layer.
A method of joining a metal electrode built on a wire which is formed on a substrate to a circuit card of which joint surface is formed of a material which diffuses into tin when heated, said metal electrode comprising multiple metallic layers including at least a first layer and a second layer lying from an outermost surface of said metal electrode toward the substrate in this order, wherein the first layer contains tin as a principal constituent, the second layer contains a metallic element which produces an eutectic reaction with tin, and the melting point of the first layer is higher than that of the second layer, and said method comprising the steps of:
Dependencies are inferred from the claim text.