Tape circuit board and semiconductor chip package including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsDae-Woo Son, Hyoung-Chan Chang
Life of this patent
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Abstract
A tape circuit board for manufacturing a fine pitch semiconductor chip package, a method for manufacturing the tape circuit board, and a semiconductor chip package using the tape circuit board are provided. The tape circuit board includes an insulating base film having a first surface and a second surface. An adhesive layer is formed on the first surface of the base film. Further, wiring patterns are formed on the adhesive layer. Conductive bumps extend through the base film and the adhesive layer and are connected to the wiring patterns. The conductive bumps extend above the second surface of the base film.
Claims5
A method of manufacturing tape circuit boards, said method comprising:
- (a) providing an insulating base film having first and second surfaces with an adhesive layer formed on the first surface;
- (b) forming bump holes extending through said adhesive layer and said base film, and a window extending therethrough for mounting a chip;
- (c) forming wiring patterns on said adhesive layer;
- (e) forming a patterned photoresist layer on said second surface of said base film so that said bump holes are open;
- (f) forming bumps connected to said wiring patterns by filling said bump holes with a conductive material using said photoresist layer as a mask;
- and
- (g) removing said photoresist layer.
Dependencies are inferred from the claim text.