Heating furnace and semiconductor wafer-holding jig assembly and process of manufacturing semiconductor devices
OwnerMikio Takagiinventor
Life of this patent
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Abstract
An assembly of heating furnace and semiconductor wafer-holding jig. This assembly includes a furnace body made of refractory or heat insulting material; a heater disposed around the inner side surface of the furnace body; a reaction chamber which forms a uniform heating zone; and a wafer-holding jig. The wafer-holding jig is capable of holding the wafer and advancing and retracting the wafer in the uniform heating region along the longitudinal direction of the furnace body. The front surface of the semiconductor wafer to be heat-treated is substantially in parallel with the surface of the heater. The assembly of the invention can be used in rapid thermal processing and the footprint of the heating furnace can be reduced.
Claims9
An assembly of heating furnace and semiconductor wafer-holding jig, comprising:
- a furnace body made of refractory or heat insulting material having at least one flat surface;
- a heater disposed around the inner side surface of said furnace body;
- a reaction chamber which forms a uniform heating zone;
- and
- a wafer-holding jig capable of holding a semiconductor wafer and advancing and retracting the semiconductor wafer in the uniform heating zone along the longitudinal axes of the furnace body, the wafer-holding jig arranged such that the front surface of the semiconductor wafer is substantially in parallel with said flat surface of said heater.
A semiconductor wafer-holding jig used in a-heating furnace, comprising:
- a gas introduction hollow conduit disposed along the longitudinal direction of the heating furnace;
- and
- a wafer-holding jig disposed on the front end of said gas introduction hollow conduit, comprising a wafer-holding portion which includes an ejection hole for ejecting a gas to the semiconductor wafer from said gas introduction hollow conduit.
Dependencies are inferred from the claim text.