Method of manufacturing a display device
AssigneeKoninklijke Philips Electronics N.V.
InventorsHerbert Lifka, Freddy Roozeboom, Rene Johan Gerrit Elfrink, Mark Thomas Johnson
Life of this patent
Estimating the term…
Abstract
ICs (20) are nearly separated from the semiconductor substrate (10) on/in which they are formed. Subsequently, the substrate is positioned upside down on a substrate (carrier) (3) which is provided with glue (21) at the location of a crystal. After attachment of the crystal to the carrier, the semiconductor substrate is removed and the crystal remains attached to the carrier e.g. at the crossing of rows and columns. The separate crystals may contain TFTs (simple AM addressing) but also more complicated electronics (address of pixel in memory+identification).
Claims15
A method of manufacturing a display device, in which a substrate is provided with groups of at least one pixel and a conductor pattern and in which a semiconductor device for supplying drive voltages to the pixel is fixed to the substrate, the method comprising the steps of
- providing a semiconductor substrate with a plurality of semiconductor devices having electric connection contacts on their surfaces,
- mutually separating the semiconductor devices in a surface region of the semiconductor substrate,
- coupling the electric connection contacts to the conductor pattern, and
- subsequently separating the semiconductor devices from the semiconductor substrate.
A method of manufacturing a display device, in which a substrate is provided with groups of at least one pixel and in which a semiconductor device for supplying drive voltages to the pixel is fixed to the substrate, the method comprising the steps of
- providing a semiconductor substrate with a plurality of semiconductor devices having electric connection contacts on their surfaces,
- mutually separating the semiconductor devices in a surface region of the semiconductor substrate,
- subsequently separating the semiconductor devices from the semiconductor substrate, and
- subsequently providing the substrate with a conductor pattern at least at the location of the semiconductor devices and coupling the electric connection contacts to the conductor pattern.
A method of manufacturing an electronic device, in which at least a substrate is provided with functional groups comprising at least a switching element, and in which a semiconductor device for supplying drive voltages to the switching element is fixed to the substrate, the method comprising the steps of
- providing the substrate with a conductor pattern,
- providing a semiconductor substrate with a plurality of semiconductor devices having electric connection contacts on their surfaces,
- mutually separating the semiconductor devices in a surface region of the semiconductor substrate,
- coupling the electric connection contacts to the conductor pattern, and
- subsequently separating the semiconductor devices from the semiconductor substrate.
A method of manufacturing an electronic device, in which at least a substrate is provided with functional groups comprising at least a switching element, and in which a semiconductor device for supplying drive voltages to the switching element is fixed to the substrate, the method comprising the steps of
- providing a semiconductor substrate with a plurality of semiconductor devices having electric connection contacts on their surfaces,
- mutually separating the semiconductor devices in a surface region of the semiconductor substrate,
- subsequently separating the semiconductor devices from the semiconductor substrate, and
- providing the substrate with a conductor pattern and coupling the electric connection contacts to the conductor pattern.
Dependencies are inferred from the claim text.