Plastic housing comprising several semiconductor chips and a wiring modification plate, and method for producing the plastic housing in an injection-molding mold

An injection mold for producing a plastic package (14), the plastic package (14) having a plurality of semiconductor chips (3) which are arranged in rows (1) and columns (2) and are arranged on a wiring board (11), and the plastic package (14) covering with its upper side (15) the upper side (10) of the wiring board (11) and at least the edge sides (6, 7, 8, 9) of the semiconductor chips (3) and the plastic package (14) having an underside (16), which comprises at least the underside (13) of the wiring board (11) with external contact regions (17) and strip-shaped bonding channel coverings (18) arranged in columns for bonding channels (12) and the injection mold (32) having an upper-side mold (33) for the production of the upper side (15) of the plastic package and an underside mold (34) for the production of the underside (16) of the plastic package and the upper-side mold (33) having an injection hopper (35) for an upper-side cavity (36) and a sealing sleeve (37), which rests in a sealing manner on the upper side (10) of the wiring board (11), and the underside mold (34) having a plurality of underside cavities (38) with sealing ribs (39), which rest in a sealing manner on the underside (13) of the wiring board (11) and surround the strip-shaped bonding channel coverings (18), and the underside cavities (38) being three-dimensionally connected to the upper-side cavity (36) via constrictions (31) in the wiring board (11) and venting bores being arranged in the underside mold (34).

A method of producing a plastic package (14), the plastic package (14) having a plurality of semiconductor chips (3) which are arranged in rows (1) and columns (2) and are arranged on a wiring board (11), and the plastic package (14) covering with its upper side (15) the upper side (10) of the wiring board (11) and at least the edge sides (6, 7, 8, 9) of the semiconductor chips (3) and the plastic package (14) having an underside (16), which comprises at least the underside (13) of the wiring board (11) with external contact regions (17) and strip-shaped bonding channel coverings (18) arranged in columns for bonding channels (12), and the method having the following method steps:

• preparation of a wiring board (11) with semiconductor chip positions arranged in rows (1) and columns (2) and sawing track regions (42) provided in between and also with at least one bonding channel (12), arranged on each semiconductor chip position, and with a constriction (31) for the three-dimensional connection of the upper side (10) and underside (13) of the wiring board (11),
• application of semiconductor chips (3) to the semiconductor chip positions, with contact areas (24) of the active upper side (4) of the semiconductor chips (3) being arranged in the region of the bonding channels (12),
• establishment of bonding connections (43) between the contact areas (24) and wiring lines on the underside (13) of the wiring board (11) in the region of the bonding channels (12),
• simultaneous placement of the upper-side mold (33) and the underside mold (34) of an injection mold, with sealing off of an upper-side cavity (36) for the production of the upper side (15) of the plastic package and underside cavities (38) for the production of bonding channel coverings (18),
• injection of package plastic molding compound (25) via an injection hopper (35) of the upper-side mold (33) and spreading of the package plastic molding compound (25) via constrictions (31) into the underside cavities (38).