Vertical mold die press machine
AssigneeTexas Instruments Incorporated
InventorAkira Matsunami
Life of this patent
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Abstract
A die mold machine for molding a plurality of semiconductor assemblies on multiple substrate/leadframes includes a plurality of die mold layers stacked vertically one above the other to form a plurality of die mold sections. The top die mold layer has at least one aperture or die hall in the top most die layer and apertures or die halls in the in-between layers for passing molding compound which flows through the die hall in the top layer down through the die halls or apertures between the die mold layers into the die mold sections for molding semiconductor assemblies on said substrate/leadframes between said die mold layers.
Claims7
A method of molding semiconductor assemblies on multiple semiconductor substrates/leadframes comprising the steps of:
- providing vertically stacked molding die layers stacked one above the other with die halls between the stacked die layers and a die hall in a top die layer;
- providing semiconductor substrates with semiconductor assemblies between said vertically stacked layers;
- and
- flowing molding compound through said top layer into the substrate/leadframe in the top die section and from the top die section through die halls between stacked die layers to the other substrate/leadframes between stacked layers.
A die mold machine for molding a plurality of semiconductor assemblies on multiple substrate/leadframes comprising:
- a plurality of die mold layers stacked vertically one above the other, said die molds layers having at least one aperture or die hall in the top most die layer and apertures or die halls in the in-between layers for passing molding compound which flows through the die hall in the top wall and down through the die halls or apertures between the die mold layers into the die mold sections for molding semiconductor assemblies on said substrate/leadframes between said die mold layers.
Dependencies are inferred from the claim text.