Leadframe-to-plastic lock for IC package
AssigneeTexas Instruments Incorporated
InventorRichard L. Mahle
Life of this patent
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Abstract
Disclosed is a method of making a mold lock for bonding leadframe-to-plastic in an IC package. Steps include providing niches from opposing sides of the leadframe. The opposing niches are arranged such that an aperture and a mechanical key are formed within the leadframe material by the partial intersection of the niches. The key is encapsulated with mold compound to form a lock. An IC package mold lock in a leadframe is also disclosed, the lock having an aperture, a key, and mold compound encapsulating the key. Additionally, an IC package employing the leadframe-to-plastic lock is disclosed.
Claims23
A method of making an IC package mold lock comprising the steps of:
- providing a first niche in a leadframe surface;
- providing an opposing niche in an opposing leadframe surface, the opposing niche partially intersecting with the first niche such that an aperture in the leadframe is defined by the intersecting portions, and such that a key is defined by the nonintersecting portions;
- and
- encapsulating the key with mold compound to form a mold lock.
An IC package mold lock comprising:
- a leadframe having an aperture, the aperture having a key;
- and
- mold compound disposed in the aperture and encapsulating the key for forming a mold lock.
An IC package comprising:
- a leadframe having a die pad and a plurality of lead fingers;
- a plurality of apertures in the leadframe, at least one of the apertures having a key;
- and
- mold compound encapsulating the key forming a mold lock.
Dependencies are inferred from the claim text.