Method of attaching a leadframe to singulated semiconductor dice

A method of attaching a semiconductor die having an active surface thereon to at least one lead of a lead frame having a plurality of leads, the semiconductor die provided from a semiconductor wafer having a plurality of semiconductor dice thereon comprising:

• identifying criteria for an acceptable semiconductor die of the plurality of semiconductor dice, identifying including one of identifying the criteria before the semiconductor die is separated from a semiconductor wafer and identifying the criteria for the acceptable semiconductor die includes identifying criteria after the semiconductor die is separated from the semiconductor wafer;
• testing the semiconductor dice of the semiconductor wafer to determine if the criteria for the acceptable semiconductor die are included in a semiconductor die of the plurality of semiconductor dice;
• applying an adhesive in a wet film state in a form of one of a liquid and a paste in a predetermined pattern to at least a portion of the active surface of more than one acceptable semiconductor die after the more than one acceptable semiconductor die has been identified using the criteria;
• partially curing the adhesive from the wet film state to an intermediate tacky and flowable state;
• and
• removably attaching portions of the at least one lead of the plurality of leads of the lead frame to the acceptable semiconductor die using the intermediate tacky and flowable state partially cured adhesive.

A method of attaching a semiconductor die to a lead frame, the semiconductor die provided from a semiconductor wafer having a plurality of semiconductor dice thereon comprising:

• identifying acceptable criteria of a semiconductor die of the plurality of semiconductor dice, identifying including one of identifying the criteria before the semiconductor die is separated from the semiconductor wafer and identifying the criteria for the acceptable semiconductor die includes identifying criteria after the semiconductor die is separated from a semiconductor wafer;
• identifying an acceptable semiconductor die having the acceptable criteria;
• applying a wet film adhesive in one of a liquid and a paste to portions of at least two lead fingers of the lead frame in a predetermined pattern;
• applying an adhesive in a wet film state in one of a liquid and a paste to portions of the active surface of the acceptable semiconductor die in a predetermined pattern;
• curing the adhesive on the at least two lead fingers of the lead frame and the acceptable semiconductor die active surface from the wet film state to an intermediate tacky and flowable state;
• and
• removably attaching the at least two lead fingers of the leadframe to the acceptable semiconductor die.

A method of attaching at least one semiconductor die having an active surface thereon to at least one lead of a lead frame having a plurality of leads, the at least one semiconductor die to be separated from a semiconductor wafer having a plurality of semiconductor dice thereon comprising:

• determining criteria for an acceptable semiconductor die of the plurality of semiconductor dice;
• testing each semiconductor die of the semiconductor wafer to determine if the criteria for the acceptable semiconductor die are included in each semiconductor die to identify an acceptable semiconductor die having the criteria;
• applying adhesive in a predetermined pattern to at least one lead of a plurality of leads of a lead frame in a form of one of a liquid and a paste before attaching the at least one lead of the lead frame to the acceptable semiconductor die;
• partially curing the adhesive from the wet film state to an intermediate tacky and flowable state while on the portions of the plurality of leads of the lead frame;
• removably attaching a portion of the at least one lead of the plurality of leads of the lead frame to a portion of the active surface of the acceptable semiconductor die using the partially cured intermediate tacky and flowable state adhesive;
• identifying additional criteria of the acceptable semiconductor die attached to the lead frame;
• testing the acceptable semiconductor die attached to the at least one lead of the plurality of leads of the lead frame to determine if the additional criteria are present in the acceptable semiconductor die;
• removing the at least one lead of the plurality of leads of the lead frame attached to the acceptable semiconductor die therefrom if the acceptable semiconductor die is determined to be an unacceptable semiconductor die based on the testing;
• and
• reworking the unacceptable semiconductor die.

A method of attaching a semiconductor die having an active surface thereon to at least one lead of a leadframe having a plurality of leads, the semiconductor die provided from a semiconductor wafer having a plurality of semiconductor dice thereon comprising:

• identifying criteria for an acceptable semiconductor die of the plurality of semiconductor dice, identifying including one of identifying the criteria before the semiconductor die is separated from a semiconductor wafer and identifying the criteria for the acceptable semiconductor die includes identifying criteria after the semiconductor die is separated from a semiconductor wafer;
• testing the semiconductor dice of the semiconductor wafer to determine if the criteria for the acceptable semiconductor die are included in a semiconductor die of the plurality of semiconductor dice;
• applying an adhesive in a predetermined pattern in a wet film state in a form of one of a liquid and a paste in a predetermined pattern to at least one lead of a plurality of leads of a lead frame and the active surface of a semiconductor die after more than one acceptable semiconductor die has been identified using the criteria;
• partially curing the adhesive from the wet film state to an intermediate tacky and flowable state;
• and
• removably attaching portions of the at least one lead of the plurality of leads of the lead frame to the acceptable semiconductor die using the intermediate tacky and flowable state partially cured adhesive.

A method of attaching a semiconductor die to a leadframe, the semiconductor die provided from a semiconductor wafer having a plurality of semiconductor dice thereon, each semiconductor die of the plurality of semiconductor dice having an active surface, comprising:

• identifying acceptable criteria of a semiconductor die of the plurality of semiconductor dice, identifying including one of identifying the criteria before the semiconductor die is separated from a semiconductor wafer and identifying the criteria for the acceptable semiconductor die includes identifying criteria after the semiconductor die is separated from a semiconductor wafer;
• identifying an acceptable semiconductor die having the acceptable criteria;
• applying a wet film adhesive in one of a liquid and a paste to portions of at least two lead fingers of the lead frame;
• applying an adhesive in a predetermined pattern in a wet film state in one of a liquid and a paste to portions of the active surface of the acceptable semiconductor die in a predetermined pattern;
• curing the adhesive on the at least two lead fingers of the lead frame and the acceptable semiconductor die active surface from the wet film state to an intermediate tacky and flowable state;
• and
• removably attaching the at least two lead fingers of the leadframe to the acceptable semiconductor die.