Semiconductor chip package and method for manufacturing the same

A method for manufacturing a semiconductor chip package, the method comprising the following steps of:

• mechanically and electrically connecting a semiconductor chip to a top surface of a main substrate;
• securely attaching the semiconductor chip to a recessed cavity on a bottom surface of an interconnection substrate;
• mechanically and electrically connecting the main substrate with the semiconductor chip to the interconnection substrate;
• cutting the main substrate to form a central substrate and a peripheral substrate substantially separated from each other, wherein the semiconductor chip is disposed on the central substrate.

A substrate for use in a semiconductor chip package, the substrate comprising:

• opposing top and bottom surfaces;
• a plurality of chip bonding pads disposed on the top surface of the substrate adapted for electrically connecting to a semiconductor chip;
• a plurality of central contact pads disposed on the bottom surface of the substrate and electrically connected to the chip bonding pads;
• a plurality of peripheral contact pads disposed on the bottom surface of the substrate;
• and
• a plurality of slots disposed between the central contact pads and the peripheral contact pads for separating the central contact pads and the peripheral contact pads.