Method and apparatus for processing semiconductor

An apparatus for processing a semiconductor in which a plurality of samples of a lot are successively supplied to a process chamber and are successively processed in an intra-lot successive process, comprising:

• a process chamber;
• a sample stand for holding a sample in the process chamber;
• a process gas supply unit for supplying a process gas to the process chamber;
• a state sensor for detecting a state in the process chamber;
• and
• an intra-lot variation pattern prediction unit including an intra-lot variation pattern database having stored relational information of sensor data detected by the state sensor and intra-lot variation patterns of results of the intra-lot successive process, wherein
• the intra-lot variation pattern prediction unit refers to the intra-lot variation pattern database according to the sensor data of the state sensor to predict intra-lot variation patterns of results of the intra-lot successive process and changes, according to results of the prediction, a process condition applied to a sample of the lot.

An apparatus for processing a semiconductor in which a plurality of samples of a lot are successively supplied to a process chamber and are successively processed in an intra-lot successive process, comprising:

• a process chamber;
• a sample stand for holding a sample in the process chamber;
• a process gas supply unit for supplying a process gas to the process chamber;
• a state sensor for detecting a state in the process chamber;
• an intra-lot variation pattern prediction unit including an intra-lot variation pattern database having stored relational information of sensor data detected by the state sensor and intra-lot variation patterns of results of the intra-lot successive process, the intra-lot variation pattern prediction unit referring to the intra-lot variation pattern database according to the sensor data of the state sensor and thereby predicting intra-lot variation patterns of results of the intra-lot successive process;
• and
• an intra-lot process condition setting unit for calculating a process condition applied to a sample of a lot according to the intra-lot variation patterns predicted by the intra-lot variation pattern prediction unit.

An apparatus for processing a semiconductor in which a plurality of samples of a lot are successively supplied to a process chamber and are successively processed in an intra-lot successive process, comprising:

• a process chamber;
• a sample stand for holding a sample in the process chamber;
• a process gas supply unit for supplying a process gas to the process chamber;
• a state sensor for detecting a state in the process chamber;
• an intra-lot variation pattern prediction unit including an intra-lot variation pattern database having stored relational information of sensor data detected by the state sensor and intra-lot variation patterns of results of the intra-lot successive process, the intra-lot variation pattern prediction unit referring to the intra-lot variation pattern database according to the sensor data of the state sensor and thereby predicting intra-lot variation patterns of results of the intra-lot successive process;
• and
• an intra-lot process condition setting unit including a machining contour control recipe database having stored recipes to control machining contours for calculating a process condition applied to a sample of a lot by referring to the machining contour control recipe database according to the intra-lot variation patterns predicted by the intra-lot variation pattern prediction unit.

A method of processing a semiconductor, comprising the steps of:

• providing a process gas supply unit for supplying a process gas to a sample stand to hold a sample in a process chamber and to the process chamber;
• successively supplying a plurality of samples of a lot to the process chamber to conduct an intra-lot successive process;
• predicting, before a lot process is started and according to sensor data detected by a state sensor to detect a state in the process chamber, intra-lot variation patterns of results of the intra-lot successive process;
• and
• changing, according to a result of the prediction by the intra-lot variation pattern prediction unit, a process condition applied to a sample of the lot and conducting the lot process.

A method of processing a semiconductor, comprising the steps of:

• providing a process gas supply unit for supplying a process gas to a sample stand to hold a sample in a process chamber and to the process chamber;
• successively supplying a plurality of samples of a lot to the process chamber to conduct an intra-lot successive process;
• preparing an intra-lot variation pattern database having stored relational information of sensor data detected by the state sensor to detect a state in the process chamber and intra-lot variation patterns of results of the intra-lot successive process;
• referring, before a lot process is started, to the intra-lot variation pattern database according to the sensor data of the state sensor and thereby predicting intra-lot variation patterns of results of the intra-lot successive process;
• and
• changing for each sample, according to results of the prediction, a process condition applied to the sample of the lot and thereby conducting the process.

A method of processing a semiconductor, comprising the steps of:

• providing a process chamber and a sample stand to hold a sample in the chamber;
• supplying by a process gas supply unit a process gas to the process chamber;
• successively supplying a plurality of samples of a lot to the process chamber to conduct an intra-lot successive process;
• preparing an intra-lot variation pattern database having stored relational information of sensor data detected by a state sensor to detect a state in the process chamber and intra-lot variation patterns of results of the intra-lot successive process;
• referring, before a lot process is started, to the intra-lot variation pattern database according to the sensor data of the state sensor and thereby predicting intra-lot variation patterns of results of the intra-lot successive process;
• calculating a quantity of variation in a machining dimension for each sample of a lot according to the variation patterns thus predicted;
• and
• changing for each sample, according to the quantity of variation in a machining dimension, a process condition applied to the sample.