Polyamic acid resin composition
AssigneeNissan Chemical Industries, Ltd.
InventorsTadashi Hatanaka, Sahade Daniel Antonio, Takayasu Nihira
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Abstract
Provided is a polyamic acid resin composition for formation of a bank, which provides excellent film characteristics and adhesion to a substrate, which can undergo patterning with use of a positive type photoresist, and which can be transformed into a polyimide after the patterning to yield a polyimide resin with upper part of film having a low surface energy. It is achieved by a polyamic acid resin composition comprising a polyamic acid [a] as a base and a polyamic acid [b] having a fluorine-containing alkyl group with a carbon number of at least 2, and containing the polyamic acid [b] in an amount of from 0.1 to 30 wt % to the total amount of the polyamic acid [a] and the polyamic acid [b].
Claims5
A polyamic acid resin composition for formation of a bank, which comprises a polyamic acid [a] having repeating units represented by the following formula (1):
- 4
- (wherein R1 is a tetravalent organic group constituting a tetracarboxylic acid or a derivative thereof, R2 is a bivalent organic group constituting a diamine, and k is an integer) and having a reduced viscosity of from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., at a concentration of 0.5 g/dl);
- and
- a polyamic acid [b] having repeating units represented by the following formula (2):
- 5
- (wherein R3 is a tetravalent organic group constituting a tetracarboxylic acid or a derivative thereof, R4 is a bivalent organic group constituting a diamine, from 1 to 100 mol % of R4 has one or more fluorine-containing alkyl groups with a carbon number of at least 2, and 1 is an integer), and having a reduced viscosity of from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., at a concentration of 0.5 g/dl);
- wherein the content of the polyamic acid [b] is from 0.1 to 30 wt % to the total amount of the polyamic acid [a] and the polyamic acid [b].
Dependencies are inferred from the claim text.