Ceramic connection body, method of connecting the ceramic bodies, and ceramic structural body
AssigneeIbiden Co., Ltd.
InventorYasutaka Ito
Life of this patent
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Abstract
It is to provide a ceramic joint body and a ceramic structural body effectively used in semiconductor production and inspection devices including a hot plate or the like, and proposes a ceramic joint body by joining ceramic bodies to each other, in which coarse pores having an average diameter larger than an average particle size of ceramic particles constituting the ceramic body and a size of not more than 2000 μm are formed in a joining interface between the one ceramic body and the other ceramic body as well as a method of joining ceramics to each other.
Claims27
A ceramic joint body formed by joining ceramic bodies to each other, characterized in that pores are formed in a joining interface between one of the ceramic bodies and the other ceramic body.
A ceramic joint body formed by joining one ceramic body to the other ceramic body, characterized in that a joining assistant layer is arranged in a joining interface between the one ceramic body and the other ceramic body and pores are formed in the joining assistant layer.
A ceramic joint body formed by joining one ceramic body to the other ceramic body, characterized in that at least a part of ceramic particles constituting the each ceramic body and existing in a joining interface is constituted by grown particles mutually penetrated into the ceramic substrate and the ceramic body on the other side across the joining interface and pores are formed in the joining interface.
A ceramic joint body formed by joining ceramic bodies, characterized in that coarse pores having an average diameter larger than ½ of an average particle size of ceramic particle constituting the ceramic body and a size of not more than 2000 μm are formed in a joining interface between the one ceramic body and the other ceramic body.
A ceramic joint body formed by joining one ceramic body to the other ceramic body, characterized in that a joining assistant layer is arranged in the joining interface between the one ceramic body and the other ceramic body and coarse pores having an average diameter larger than ½ of the average particle size of the ceramic particle constituting the ceramic body and a size of not more than 2000 μm are formed in the joining assistant layer.
A ceramic joint body formed by joining one ceramic body to the other ceramic body, characterized in that at least a part of the ceramic particles constituting each ceramic body and existing in the joining interface is constructed with grown particles mutually penetrated into the ceramic substrate and the ceramic body across the joining interface and coarse pores having an average diameter larger than ½ of the average particle size of the ceramic particle constituting the ceramic body and a size of not more than 2000 μm are formed in the joining interface.
A ceramic joint body formed by joining ceramic bodies to each other, characterized in that coarse pores having an average diameter larger than an average particle size of a ceramic particle constituting the ceramic body and a size of not more than 2000 μm are formed in a joining interface between the one ceramic body and the other ceramic body.
A ceramic joint body formed by joining the one ceramic body to the other ceramic body, characterized in that a joining assistant layer is arranged in the joining interface between the one ceramic body and the other ceramic body and coarse pores having an average diameter larger than the average particle size of the ceramic particle constituting the ceramic body and a size of not more than 2000 μm are formed in the joining assistant layer.
A ceramic joint body formed by joining one ceramic body to the other ceramic body, characterized in that at least a part of the ceramic particles constituting each ceramic body and existing in the joining interface is constructed with grown particles mutually penetrated into the ceramic substrate and the ceramic body across the joining interface and coarse pores having an average diameter larger than the average particle size of the ceramic particle constituting the ceramic body and a size of not more than 2000 μm are formed in the joining interface.
A ceramic structural body formed by joining a ceramic substrate provided in its inside with a conductor to a ceramic body, characterized in that pores are formed in a joining interface between the ceramic substrate and the ceramic body.
A ceramic structural body formed by joining the ceramic substrate provided in its inside with the conductor to the ceramic body, characterized in that a joining assistant layer is arranged in the joining interface between the ceramic substrate and the ceramic body and pores are formed in the joining assistant layer.
A ceramic structural body formed by joining the ceramic substrate provided in its inside with the conductor to the ceramic body, characterized in that at least a part of the ceramic particles constituting the ceramic substrate and the ceramic body is constructed with grown particles mutually penetrated into the ceramic substrate and the ceramic body across the joining interface and pores are formed in the joining interface.
A ceramic structural body formed by joining a ceramic substrate provided in its inside with a conductor to a ceramic body, characterized in that coarse pores having an average diameter larger than ½ of an average particle size of ceramic particles constituting the ceramic body and a size of not more than 2000 μm are formed in a joining interface between the ceramic substrate and the ceramic body.
A ceramic structural body formed by joining the ceramic substrate provided in its inside with the conductor to the ceramic body, characterized in that a joining assistant layer is arranged in the joining interface between the ceramic substrate and the ceramic body and coarse pores having an average diameter larger than ½ of the average particle size of the ceramic particles constituting the ceramic body and a size of not more than 2000 μm are formed in the joining assistant layer.
A ceramic structural body formed by joining the ceramic substrate provided in its inside with the conductor to the ceramic body, characterized in that at least a part of the ceramic particles constituting the ceramic substrate and the ceramic body is constructed with grown particles mutually penetrated into the ceramic substrate and the ceramic body across the joining interface and coarse pores having an average diameter larger than ½ of the average particle size of the ceramic particles constituting the ceramic body and a size of not more than 2000 μm are formed in the joining interface.
A ceramic structural body formed by joining a ceramic substrate provided in its inside with a conductor to a ceramic body, characterized in that coarse pores having an average diameter larger than an average particle size of ceramic particles constituting the ceramic body and a size of not more than 2000 μm are formed in a joining interface between the ceramic substrate and the ceramic body.
A ceramic structural body formed by joining the ceramic substrate provided in its inside with the conductor to the ceramic body, characterized in that a joining assistant layer is arranged in the joining interface between the ceramic substrate and the ceramic body and coarse pores having an average diameter larger than the average particle size of the ceramic particles constituting the ceramic body and a size of not more than 2000 μm are formed in the joining assistant layer.
A ceramic structural body formed by joining the ceramic substrate provided in its inside with the conductor to the ceramic body, characterized in that at least a part of the ceramic particles constituting the ceramic substrate and the ceramic body is constructed with grown particles mutually penetrated into the ceramic substrate and the ceramic body across the joining interface and coarse pores having an average diameter larger than the average particle size of the ceramic particles constituting the ceramic body and a size of not more than 2000 μm are formed in the joining interface.
A method of forming a ceramic composite body by joining one ceramic body to the other ceramic body, characterized in that a surface of at least one of these ceramic bodies to be joined is first mirror-polished to less than 0.1 μm of Rmax and then the mirrored surface is subjected to a blast treatment so as to be a roughness having Rmax of not less than 0.1 μm, and a joining assistant using a yttrium compound and/or ytterbium compound is directly or indirectly applied to the joining surface and fired at a temperature of not higher than 1800° C.
Dependencies are inferred from the claim text.