Freewire system for suppression of particulate deposition and accumulation on processing chamber walls
OwnerAaron D. Mao, Samuel L. Antonio +1inventors
InventorsAaron D. Mao, Samuel L. Antonio, Pom Hyare
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Abstract
Particulate deposition and accumulation is suppressed in a process chamber arranged for flow of gas therethrough, and including a gas-contacting surface, wherein the gas is susceptible to the presence or generation of particulate solids. A motive driver is arranged to provide a rotational driven movement output and is coupled to a flexible, elongate abrading element that has a free end disposed in the process chamber so that upon rotation by the motive driver, the abrading element engages the gas-contacting surface to abradingly remove particulate solids therefrom.
Claims52
A process system comprising:
- (a) a process chamber arranged for flow of gas therethrough, and including a gas-contacting surface, wherein the gas is susceptible to the presence or generation of particulate solids;
- (b) a motive driver arranged to provide a rotational driven movement output;
- and
- (c) a flexible, elongate abrading element, free-ended at a first end thereof and coupled at a second end thereof to the motive driver, for rotational driven movement of the abrading element so that the abrading element engages said gas-contacting surface during said rotational driven movement to abradingly remove particulate solids therefrom.
A method of suppressing solids build-up in a process chamber arranged for flow of gas therethrough, and including a gas-contacting surface, wherein the gas is susceptible to the presence or generation of particulate solids, said method comprising rotationally driving a flexible, elongate abrading element at one end thereof, wherein the flexible, elongate abrading element is free-ended at its opposite end, so that the abrading element engages said gas-contacting surface during rotational driven movement to abradingly remove solids therefrom.
Dependencies are inferred from the claim text.