Structure and System-on-Chip Integration of a Two-Transistor and Two-Capacitor Memory Cell for Trench Technology
AssigneeInternational Business Machines Corporation
InventorsToshiaki Kirihata, John W Golz
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AssigneeInternational Business Machines Corporation
InventorsToshiaki Kirihata, John W Golz
Estimating the term…
A two-port dynamic random access memory (DRAM) cell consisting of two transistors and two trench capacitors (2T and 2C DRAM cell) connecting two one transistor and one capacitor DRAM cell (1T DRAM cell) is described. The mask data and cross-section of the 2T 2C DRAM and 1T DRAM cells are fully compatible to each other except for the diffusion connection that couples two storage nodes of the two 1T DRAM cells. This allows a one-port memory cell with 1T and 1C DRAM cell and a two-port memory cell with 2T and 2C DRAM cell to be fully integrated, forming a true system-on chip architecture. Alternatively, by halving the capacitor, the random access write cycle time is further reduced, while still maintaining the data retention time. The deep trench process time is also reduced by reducing by one-half the trench depth.
A memory cell comprising two transistors and two trench capacitors, wherein one of said two transistors is controlled by a first wordline that selectively couples a storage node of said two trench capacitors to a first bitline, and the other of said two transistors is controlled by a second wordline that selectively couples said storage node to a second bitline.
A system on-chip comprising a first memory cell, comprising a 1-port memory cell formed by one transistor and one trench capacitor, wherein said one transistor is controlled by a wordline that selectively couples a storage node of said trench capacitor to a bitline;
A system-on chip comprising:
Dependencies are inferred from the claim text.