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US 2004/0174680 A1Published application
Circuit arrangement for components to be cooled and corresponding cooling method
AssigneePatent-Treuhand-Gesellschaft Fur Elektrische Gluhl
InventorsMartin Grabner, Friedrich Witzani
Life of this patent
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Abstract
The invention proposes a simpler way of removing heat from integrated power components. For this purpose, a heat transfer device, in particular a thermally conducting mat (3), is inserted between the components (2) to be cooled and a core of an inductive component (4). The heat produced by the power semiconductors (2) can thus be dissipated to the core of the inductive component (4).
Claims14
A circuit arrangement having
- a component (2) to be cooled,
- comprising
- an electrical component in the form of a heat sink, which is an active part of the circuit arrangement, in particular an inductive component (4) having a core, and
- a heat transfer device (3), which is arranged between the component (2) to be cooled and the electrical component in the form of a heat sink such that it is in direct contact with the two for the purpose of removing heat from the component (2) to be cooled.
1 more element
A method for cooling an electronic component (2) of an electrical circuit by
- providing the component (2) to be cooled of the electrical circuit,
- providing an electrical component, actively participating in the electrical circuit, in the form of a heat sink, in particular an inductive component (4), which has a core, and
- inserting a heat transfer device (3) between the component (2) to be cooled and the component acting as the heat sink such that it is in direct contact with the two for the purpose of removing heat from the component (2) to be cooled.
Dependencies are inferred from the claim text.