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US 2004/0173818 A1Published application
Binder diffusion transfer patterning of a thick film paste layer
AssigneeE.I. du Pont de Nemours and Company
InventorLap-Tak Andrew Cheng
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Abstract
The present invention concerns a process for the fabrication of electrical and electronic devices. A polymer film is patterned on a substrate. A thick film paste is deposited over the patterned polymer. The thick film paste is dried under conditions which allow diffusion of the polymer into the thick film paste. This renders the diffused area insoluble in alkaline development solution.
Claims6
A process comprising:
- a) depositing a patterned film of polymer A on a substrate;
- b) depositing a thick film paste over the patterned film of polymer A;
- c) drying of the thick film paste during which the patterned polymer A diffuses into the paste layer thus transferring the pattern to the paste layer;
- and
- d) removing the excess thick film paste from area absence of polymer A by exposing the paste layer to a paste developer solution which has poor solubility to polymer A.
2 more elements
A process comprising:
- a) depositing a positive photo resist on a substrate
- b) masking a pattern on the resist
- c) exposing the resist to light through the patterned mask
- d) developing the resist
- e) depositing thick film paste over the patterned photoresist
- f) drying the thick film paste
- g) removing the excess thick film paste that has not mixed with the photo resist.
4 more elements
Dependencies are inferred from the claim text.