US 2004/0171297 A1Published application

Two-layer connector assembly

AssigneeDelta Electronics, Inc.

InventorsHan-Cheng Hsu, Chih-Tse Chen, Ching-Man Kao

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Abstract

Double-layer connector assembly has an upper-layer shielding housing, a lower-layer shielding housing, and a number of two-layer modules. Each two-layer module has an upper unit, a lower unit, and a supporting body. The upper unit has upper output pins and an upper guiding plate, and the lower unit has lower output pins and a lower guiding plate. The upper guiding plate and the lower guiding plate are connected by the supporting body and form a slit. Supporting plates of the upper-layer shielding housing and the lower-layer shielding housing are installed into the slit so that the upper-layer shielding housing, the lower-layer shielding housing are installed, and two-layer modules are connected together. Besides, processing circuits are selectively connected to the output pins of the upper and lower units so that the design is more compact.

Claims16

Dependent claims

A two-layer connector assembly comprising:

a plurality of two-layer modules, each two-layer module comprising:
an upper-layer unit having a plurality of upper output pins and an upper guiding plate wherein said upper output pins are installed on said upper guiding plate;
a lower-layer unit having a plurality of lower output pins and a lower guiding plate wherein said lower output pins are installed on said lower guiding plate;
and
a supporting body for connecting said upper-layer unit and said lower-layer unit such that said upper guiding plate and said lower guiding plate aligning in substantially parallel arrangement and a slit being defined between said upper guiding plate and said lower guiding plate;
an upper-layer shielding housing wherein said upper-layer shielding comprises a first supporting slice and defines a plurality of upper-layer through holes, and each said upper-layer through hole contains one said upper-layer unit of one said two-layer module;
and
an lower-layer shielding housing wherein said lower-layer shielding housing comprises a second supporting slice and defines a plurality of lower-layer through holes, and each said lower-layer through hole contains one said lower-layer unit of one said two-layer module;
wherein said upper-layer through holes and said lower-layer through holes are arranged as two mirrored rows, and said first supporting slice and said second supporting slice are placed in said slit in the manner of a stack such that said upper shielding housing, said lower shielding housing and said plurality of two-layer modules are connected together.

6 more elements

A two-layer module connected with a printed circuit board comprising:

a supporting body;
an upper-layer unit comprising a plurality of upper connecting devices and an upper guiding plate, wherein each said upper connecting device comprises an upper output pin, an upper intermediate device and an upper input pin, and wherein said upper input pin is electrically connected to said printed circuit board, said upper output pin is installed on said upper guiding plate, said upper guiding plate is connected to said upper guiding plate, said upper guiding plate is connected to said supporting body, said upper intermediate device is electrically connected to said upper output pin and said upper input pin, and said upper intermediate device selectively comprises a upper processing circuit for processing signals transmitted between said upper input pin and said upper output pin;
and
a lower-layer unit comprising a plurality of lower connecting devices and a lower guiding plate, wherein each said lower connecting device comprises a lower output pin, a lower intermediate device, and a lower input pin, and wherein said lower input pin is electrically connected to said printed circuit board, said lower output pin is installed on said lower guiding plate, said intermediate device is electrically connected to said lower output pin and said lower input pin, said lower intermediate device selectively comprises a lower processing circuit for processing signals transmitted between said lower input pin and said lower output pin,
wherein said upper guiding plate and said lower guiding plate are connected to said supporting body such that said upper guiding plate and said lower guiding plate arranges in parallel substantially.

2 more elements

Dependencies are inferred from the claim text.